Tensilica and Design IP Blogs

We now look to scale the architecture from Good-enough earbuds, to Better (mid-tier) and Best (high-end) models. While adding features and improving user experience, we hope to preserve the software investment made by OEM and/or SoC vendors. This is essential for fast time-to-market, as we reach to grab a larger portion of the available market TAM.

It is important that OEMs and SoC providers of TWS earbuds prepare to offer the quality and features the market expects of next generation products. Here, we explore the architecture of the signal path and the approach to scaling it across different product tiers.

The automotive industry is inching towards enhancing the driver’s experience and overall safety. We have seen a plethora of technological innovations such as ADAS, tire pressure monitoring, automated emergency braking, IOT etc. that have improved vehicle performance, efficiency, reliability, and safety. Autonomous driving is leading to major disruptions in the automotive industry. Light used Tensilica V7 for depth perception...

The design impairments such as SoC packaging, package-to-board impedance mismatch, and crosstalk due to front panel and backplane connector, as well as noise coupling could have a significant impact on the bit error rate (BER) in a production system. mentioned in Such design impairments These impairments have a much bigger impact as we move towards 112G data rate because of smaller UI and lower SNR. By prescribing the...

Real-time FFT performance in Radar, Lidar, and ADAS applications is limited by data bandwidth, data reordering and shuffling of data, and increases in complexity as the size of FFT increases. Using a parallel FFT architecture scheme eliminates such limitations and results in better resource utilization and up to 3126 X speed up.

DesignCon 2021, Drive World Conference, and Embedded Systems Conference are a joint event this year. Cadence had an opportunity to present at a session on behalf of PCI-SIG. The topic of the presentation is "PCI Express Technology: Accelerating Automotive Connectivity, from Infotainment to ADAS." I covered the portion on automotive trends and highlighted the various new automotive applications that are driving the transition...

Since its inception, PCI Express® (PCIe®) has proliferated quickly to become ubiquitous in the modern digital world. Today, PCIe is an indispensable technology found in high-performance computing, AI/ML accelerators, network adapters, and solid-state storage, to name a few. In addition, recent advances in speed and latency of PCIe have allowed it to gain wider adoption within the memory hierarchy as well (e.g., persistent...

If a picture is worth a thousand words, a video tells you the entire story. Cadence's subsystem SoC silicon for PCI Express (PCIe) 5.0 demo video shows you how we put together the latest technology in TSMC's advanced FinFET technology to bring to market a compelling, low-power solution and tested it with the latest industry test solutions available. https://youtu.be/Mgy5Z-sKs6E The subsystem contains Cadence's...

Cadence was the first IP provider to bring controllers for PCI Express (PCIe) 3.0 to the market and the lowest power 3.0 PHY at introduction. We're proud to continue the trend with our solution for PCIe 5.0 that continues to blaze the trail with new benchmarks for power, performance, and area. Figure 1: I/O Bandwidth doubling every three years and PCI Specification Updates The PCIe standard has been around for...

PCI-SIG DevCon 2019 APAC tour has come to Tokyo and Taipei this year. The focus is predominantly around the latest updates for PCIe Gen 5 which its version 1.0 specification was just released this year in May. A series of presentations provided by PCI-SIG on the day 1 with comprehensive information covering all aspects of Gen 5 specification, including protocol, logical, electrical, compliance updates. On the day 2 ...

The PCI-SIG finalized the PCIe 4.0 specification with doubling the data to 16GT/s from 8GT/s in PCIe 3.0 in 2017. Products implementing this technology have begun to hit the market in 2019. Earlier this year, AMD announced it X570 chipset would support the PCIe 4.0 interface and Phison also introduced the world’s first PCIe 4.0 SSD. With the increasing companies are working on PCIe 4.0 related product development, Cadence...

PCIe has been widely adopted in the electronics industry since its first debut in 2003 (PCIe 1.0 standard release) for wide breach of applications, from Data Center Server, Networking, to Mobile, AI/ML, Automotive, IoT, and many others…. It’s a versatile, high-performance, robust, mature interconnect standard with full “backward compatibility” (e.g., a PCIe 3.0 device can still function well in a PCIe 4.0 system) which...

Test chips are becoming more widespread and more complex at advanced process nodes as design teams utilize early silicon to diagnose problems prior to production. But this approach also is spurring questions about whether this approach is viable at 7nm and 5nm, due to the rising cost of prototyping advanced technology, such as mask tooling and wafer costs. Semiconductor designers have long been making test chips to...

Differentiating good IP from mediocre or bad IP is getting more difficult, in part because it depends upon how and where it is used and in part, because even the best IP may work better in one system than another—even in chips developed by the same vendor. So, how do you measure IP quality and why it is so complicated? The answer depends on who is asking. Most of the time, the definition of IP quality depends on...

With Moore’s Law, the industry assumes that when you go from one geometry to the next finer node, you will have performance gains. All this is automatic. Chip designers have tried to leverage improvements in process technology to get performance improvements for many years now. Let’s examine whether or not this assumption is still valid. When we were at more mature technologies, such as 90nm to 65nm, there may have...

Trust. Privacy. Confidentiality. These are three important concerns for designers of IoT edge devices. Today NXP announced that they are addressing these concerns with two new platforms that feature secure execution environment (SEE) to give developers access to “unprecedented” security capabilities. These platforms provide a multi-layered, hardware-enabled protection scheme to secure IoT edge devices and cloud-to...

Did you make it to MWC Shanghai? I didn’t, but I read about what was hot – narrowband (NB) IoT. Three of Cadence’s customers had Tensilica Fusion F1 DSP demos on the show floor. Xinyi Information Technology, a China-based company, showed off the first single-core modem that integrates a CMOS power amplifier with the modem. Their Marconi X1 modem features an NB-IoT protocol stack from Huachang Technology, who was able...

I was asked the following question recently. No longer are we seeing increasing amounts of functionality being crammed into chips, except under very special circumstances. Chips today are trending towards the leaner side. Is this only when power is a primary concern? Does this apply to all technology nodes or only to larger ones? What about pins – I/O has often been the limiter. What impact will this have on IP? Will...

At the Cadence booth at Mobile World Congress in Barcelona, we’re featuring a demo of a software-based GPS receiver from Galileo Satellite Navigation running off a Cadence Tensilica Fusion F1 DSP. It’s a very impressive demo—come by...

What is a software GPS, what does it have to do with Tensilica DSP IP, and why would anyone care? To answer that, let's start with a quiz from the transportation industry. How many shipping containers are currently in transit around the world? It turns out that no one knows for sure, but the best guess is that there are about 20 million containers in service today. And it's a safe bet that those containers are carrying...

I’ve been going to Mobile World Congress in Barcelona for over 10 years, and it never fails to amaze me. This year’s theme is “Creating a Better Future” and I can’t think of a better theme for Cadence – our Tensili...

While attending the recent DesignCon show for the first time, I was struck by the many displays of cables, connectors, boards, and various kinds of test equipment (you can read about the impact this had on me in my previous post, A Walk Through DesignCon Turns Into a Long Journey ). There was so much hardware, in fact, that I felt like I was walking through a giant Fry’s store. The impression was so strong that my first...

Have you ever attended the DesignCon show? I attended the recent event for the first time and was surprised by what I saw: tons of high-bandwidth coax cables, circuit boards, connectors, and other hardware—all harnessed to very expensive scopes and channel analyzers displaying perfect eye diagrams. This was definitely a show for hardware engineers. Walking around the show floor brought on an unexpected feeling...

I wouldn't believe it if I hadn't heard it myself on a laptop in the Cadence booth at the Consumer Electronics Show ( CES) this year. Through a great innovation by our partner Dolby, you can now get surround sound on your laptop! You’ve probably been in a movie theater with Dolby’s latest innovation— Dolby Atmos . And maybe you’ve purchased a television in the last year with Dolby Atmos (it was a huge sensation at...

Want to see the exciting technology that is behind some of the biggest innovations at CES? Book a meeting now to visit the Cadence invitation-only suites at CES 2018, January 9-12, South Hall 2, Suite MP2577 (same location as last year). See Tensilic...