Corporate News - Cadence Blogs

Helping Physical AI See the Unseen: How EYE4NIR Is Advancing SWIR Imaging

Imagine driving through dense fog yet being able to see clearly beyond what the human…

Tanushri Shah 20 Aug 2026 • 1 min read

Virtuoso Studio , physical ai , designed with cadence , cadence cloud , design for AI

Honda + Cadence = Physical AI (part 3): Creating a Chip the World Has Never Seen

Hello everyone. I'm Kentaro Komori, an engineer in the Semiconductor Research at…

Corporate 19 Aug 2026 • 9 min read

featured , physical ai , HGR , AI , Honda

See AuraStack AI Super Agent in Action!

Modern AI systems are pushing electronic design into a new phase of complexity. High…

Reela Samuel 18 Aug 2026 • 3 min read

AuraStack AI Super Agent , Allegro X AI , featured , agentic ai , Super Agent , AuraStack , AI for design , design for AI , AI

DAC 2026 Wrap-Up: AI-Powered Engineering Moves from Vision to Workflow Reality

Every year, Design Automation Conference (DAC) brings big announcements, packed demos…

Corporate 7 Aug 2026 • 5 min read

Jasper Formal Verification Platform , featured , agentic ai , DAC 2026 , AI for design , design for AI , millennium

Samsung Foundry and Cadence Expand Infrastructure and Physical AI Solution

Today, AI infrastructure is driving a fundamental shift in semiconductor design.…

Corporate 31 Jul 2026 • 7 min read

featured , chiplets , infrastructure ai , SF2P , physical ai , NVIDIA , advanced packaging , Samsung , AI for design , Ambarella , design for AI , advanced nodes , 3D-IC Technology , design stack , 2nm

AI Semiconductor Design at 3nm and 2nm: Silicon-Proven IP

As AI workloads scale in size, complexity, and performance requirements, delivering…

Corporate 30 Jul 2026 • 4 min read

advanced nodes , 3dfabric , AI silicon , TSMC-COUPE , system integration

HPE: Designing Data Centers for AI at Scale

One of the biggest inefficiencies in modern data centers is the disconnect between…

Tanushri Shah 30 Jul 2026 • 2 min read

digital twin , designed with cadence , Cadence Reality Digital Twin Platform

Cadence Certifies AI-Driven Reference Flows for Intel 18A-P and Intel 14A

The expanded Cadence-Intel Foundry collaboration delivers silicon-proven digital…

Corporate 27 Jul 2026 • 3 min read

DAC , Design IP , featured , DAC 2026 , AI-Driven Design , Process Design Kit , Intel Foundry

The Autonomous Chip-to-System Engineer Has Arrived

How Cadence, in collaboration with NVIDIA, is building the industry's first silicon…

Corporate 26 Jul 2026 • 4 min read

AuraStack AI Super Agent , DAC , featured , agentic ai , NVIDIA , ChipStack AI Super Agent , AI

Cadence’s Agentic AI Design Vision Takes Center Stage at DAC

AI infrastructure demands are changing what semiconductor design must solve. The…

Corporate 22 Jul 2026 • 4 min read

AuraStack AI Super Agent , featured , agentic ai , DAC 2026 , ChipStack AI Super Agent , InnoStack AI Super Agent , ViraStack AI Super Agent

Jilin University Accelerates Student Racing Success Using Fidelity CFD Software

Founded in 1955, the College of Automotive Engineering at Jilin University has a…

Tanushri Shah 21 Jul 2026 • 2 min read

CFD , designed with cadence , Fidelity CFD

The Three Phases of AI Adoption

Artificial intelligence is often discussed as if the industry is moving through a…

Corporate 15 Jul 2026 • 6 min read

infrastructure ai , agentic ai , physical ai , sciences ai , Three-Layer Cake , AI-Driven Design , AI for design , design for AI

The Three-Layer Cake: The Foundation Behind Intelligent Engineering

Artificial intelligence is rapidly becoming the engine behind the next era of technology…

Corporate 15 Jul 2026 • 7 min read

infrastructure ai , agentic ai , Principled Simulation , physical ai , Three-Layer Cake , AI-Driven Design , AI for design , Agents , design for AI , AI

Design for AI and AI for Design

The semiconductor industry is experiencing a once-in-a-generation transformation…

Corporate 15 Jul 2026 • 6 min read

Allegro X AI , infrastructure ai , agentic ai , Integrity 3D-IC Platform , physical ai , Semiconductor Innovation , AI for design , ChipStack AI Super Agent , design for AI , Clarity 3D Solver , Super Agents

AI Infrastructure Starts Beyond the Chip

Why Advanced Packaging and PCB Design Have Become the Next Frontier of Innovation…

Corporate 15 Jul 2026 • 8 min read

chip , featured , AI infrastructure , agentic ai , packaging , physical ai , Super Agent , AuraStack , AI for design , PCB design , AI , multiphysics

How the New ASK AI Assistant Makes Support More Seamless

Finding the right answer often takes more than one question. Users may start with…

Corporate 13 Jul 2026 • 2 min read

featured , customer support , Generative AI , ASK Portal , ASK AI Assitant

How Cadence and TSMC Are Accelerating AI Silicon Design at Advanced Nodes

Designing AI silicon for increasing AI/HPC workloads at advanced nodes has become…

Corporate 12 Jul 2026 • 5 min read

Advanced Node , TSMC Certified design flows , AI silicon

Finding What Truly Moves You: Honoring Alberto Sangiovanni-Vincentelli

"Finding what truly moves you is happiness. Success is measured in the lasting impact…

Corporate 24 Jun 2026 • 2 min read

featured , EDA , Alberto Sangiovanni-Vincentelli , UC Berkeley

Accelerating Drug Discovery with Agentic AI and Computational Science

By Louis Culot, corporate vice president and general manager, Cadence Molecular Sciences…

Corporate 23 Jun 2026 • 3 min read

drug discovery , Cadence Molecular Sciences , featured , agentic ai , NVIDIA , BioNeMo , openeye , computational science

Honda + Cadence = Physical AI (part 2): Where Physical AI Will Be Won

Hello everyone, I'm Atsushi Ogawa, Center Head of HGR. The real challenge of physical…

Corporate 22 Jun 2026 • 8 min read

featured , physical ai , HGR , AI , Honda

The New ASK Portal Brings a Smarter, Faster, and More Intuitive Experience

Finding the right support content should be simple, fast, and intuitive. The new…

Corporate 22 Jun 2026 • 2 min read

featured , customer support , New ASK Portal , ASK Gen AI

Honda + Cadence = Physical AI (part 1): What Does “Physical AI” Really Mean?

Hello everyone, I'm Atsushi Ogawa, Center Head of HGR. The more widely the term …

Corporate 15 Jun 2026 • 7 min read

featured , physical ai , HGR , AI , Honda

Cadence CEO Outlines the Path to the CMOS 2.0 Era at IMEC ITF World 2026

At this year's ITF World 2026 in Antwerp, Belgium, global technology leaders gathered…

Corporate 21 May 2026 • 4 min read

CMOS 2.0 , featured , imec , AI for design , XTCO , ITF World 2026 , CEFT , design for AI

Welcoming EMA Design Automation and FlowCAD to Cadence

We're excited to share that the EMA Design Automation and FlowCAD teams have joined…

Corporate 20 May 2026 • 2 min read

featured , Ultra Librarian , EMA , System Design and Analysis

ams OSRAM: Lighting the Path Forward with Intelligent Sensing

For more than a century, ams OSRAM has stood at the forefront of light and sensor…

Tanushri Shah 7 May 2026 • 2 min read

designed with cadence

2.5D + 3D = “3.5D”!

Architecting the Next Generation of AI Silicon The semiconductor industry is no longer…

Reela Samuel 5 May 2026 • 5 min read

Allegro X AI , Integrity 3D-IC Platform , 3D-IC , advanced packaging , AI-Driven Design , AI for design , 3.5D , AI/ML , AI , 2.5D , semiconductors

From the Frontlines of Agentic AI EDA: Accelerated by the Arm Computing Era

A Report from CadenceLIVE Silicon Valley 2026 CadenceLIVE Silicon Valley 2026 opened…

ShrutiAnand 21 Apr 2026 • 3 min read

CadenceLIVE Silicon Valley 2026 , featured , agentic ai , Arm compute , partnership , cadencelive , Ecosystem Collaboration , ARM

CadenceLIVE Wrap-Up: Where AI, Chiplets, and System Design Converged

CadenceLIVE Silicon Valley 2026 has come to a close. What unfolded over the course…

Veena Parthan 17 Apr 2026 • 3 min read

CadenceAI , featured , demo booths , agentic ai , CadenceLIVE2026 , Event Wrap-up , physical ai , AI for design , fireside chat , cadencelive , ChipStack AI Super Agent , design for AI , semiconductor conference 2026 , volunteering , Customer Presentations

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