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Cadence at DesignCon 2026: AI-Driven Design from Booth to Best Paper

When the industry's toughest engineering questions meet their sharpest minds, you…

Veena Parthan
• 6 min read
featured , AI-Driven Design , DesignCon 2026

Powering the AI Supercycle: Design for AI and AI for Design

At the IEEE International Solid-State Circuits Conference (ISSCC) 2026 in San Francisco…

Reela Samuel
• 4 min read
Multi-Agent Systems , featured , AI Supercycle , agentic ai , automation

The New Engineering Stack: Accelerated Computing and Agentic AI

Accelerated computing is now the primary design hardware platform for engineering…

Corporate
• 3 min read
featured , GTC , NVIDIA
Corporate News
Latest blogs

Reinventing Embedded Memory: How RAAAM Is Solving the SRAM Scaling Wall

As AI, automotive, and data centers continue to scale exponentially, one part of…

• 2 min read
spectre simulation , Virtuoso Studio , designed with cadence , Voltus

Cadence at DesignCon 2026: AI-Driven Design from Booth to Best Paper

When the industry's toughest engineering questions meet their sharpest minds, you…

• 6 min read
featured , AI-Driven Design , DesignCon 2026

Powering the AI Supercycle: Design for AI and AI for Design

At the IEEE International Solid-State Circuits Conference (ISSCC) 2026 in San Francisco…

• 4 min read
Multi-Agent Systems , featured , AI Supercycle , agentic ai , automation , AI-Driven Design , EDA , Digital Twins , Mental Model , AI

Reinventing Optical Computing: Neurophos’ Breakthrough in Photonic Transistors

Optical computing has been around since the late 1980s. The idea of using light instead…

• 2 min read
designed with cadence , photonics

The New Engineering Stack: Accelerated Computing and Agentic AI

Accelerated computing is now the primary design hardware platform for engineering…

• 3 min read
featured , GTC , NVIDIA

Cadence and NeoLogic Develop Energy-Efficient, High-Performance Processors

Cadence recently expanded its collaboration with Israeli company NeoLogic, which…

• 3 min read
designed with cadence

The New Engineering Stack at NVIDIA GTC 2026

Together, accelerated computing and agentic AI are redefining both the engine and…

• 4 min read
featured , GTC , NVIDIA , data center , digital twin , accelerated compute , AI

Celtro – Making Medical Implants Battery-Free

The average battery in a pacemaker occupies approximately 60 to 80% of its space…

• 1 min read
designed with cadence

Inside Cadence Digital Design and Signoff Excellence Event

If there was one unmistakable message from the Advancing Digital Design and Signoff…

• 4 min read
Cadence Connect , Digital Design and Signoff Excellence

Pointcloud – Helping Machines View the World in 3D

For humans, understanding the world in three dimensions comes naturally. We can instantly…

• 1 min read
designed with cadence

From Cloud to Sensor: Neuronova on Building Truly Efficient AI Sensors

As AI moves from the cloud to the edge, power is becoming the new bottleneck, replacing…

• 6 min read
designed with cadence , AI

Neuronova – Scaling Ultra-Low-Power Edge Intelligence for Smart Devices

For decades, the data collection pipeline for sensors has been the exact same—measure…

• 2 min read
designed with cadence

Advancing ASK Portal Customer Support with Gen AI Features and an AI Assistant

Cadence has set a new benchmark in customer support excellence with its flagship…

• 2 min read
customer support , ASK Gen AI , ASK Portal , ASK AI Assitant , AI

Faster and Intelligent Customer Case Resolution with Cadence ASK Portal

Today, enterprise leaders are striving to provide exceptional customer experiences…

• 1 min read
Cadence ASK Portal , customer support

Cadence Celebrates 20 Years in Pune, Reinforces Long-Term R&D Commitment

Cadence, a global leader in electronic system design, is celebrating 20 years in…

• 1 min read
news story , featured , Cadence Culture

3D-IC Market Outlook: Technology Roadmaps, Readiness, and Design Implications

The 3D-IC market outlook is entering a decisive phase as the semiconductor industry…

• 7 min read
cadence , advanced packaging , Cadence Integrity 3D IC Design Platform , 3D-IC Technology , 3D-IC Market Outlook

Cadence 3D-IC Success Stories: Faster Bandwidth, Lower Power, On-Time Tapeouts

As scaling at advanced nodes becomes increasingly constrained by cost, yield, and…

• 6 min read
advanced packaging , tapeouts , hetrogenous integration , Cadence Integrity 3D IC Design Platform , 3D-IC Technology , faster bandwidth

3D-IC Test and Reliability: KGD Strategies, Access Architecture, & Failure Mode

3D-IC technology is redefining how advanced systems are built, but it also introduces…

• 7 min read
Celsius Thermal Solver , Allegro X AI , Integrity 3D-IC Platform , kgd , advanced packaging , Yield management , multi-die 3d-ic solution , 3D-IC Technology

Cadence Tapes Out UCIe IP Solution at 64G Speeds on TSMC N3P Technology

Delivering the next wave of chiplet innovation, Cadence has successfully taped out…

• 2 min read
news story , ucie , featured , chiplets , TSMC N3P , 64G , chiplet connectivity

3D-IC in AI, HPC, and 5G: Bandwidth, Latency, and Energy per Bit Advantages

3D-IC technology is rapidly becoming the backbone of next-generation compute systems…

• 5 min read
Celsius Thermal Solver , Adavanced Packaging , Allegro X AI , Integrity 3D-IC Platform , AI-Driven Design , HPC , 3D-IC Technology , bandwidth , latency , Clarity 3D Solver , Energy per Bit

Industry’s First End-to-End eUSB2V2 Demo for Edge AI and AI PCs at CES

Since their debut in 2023, AI PCs have taken the market by storm. Gartner projects…

• 4 min read
news story , eUSB2v2 , Edge AI , Design IP , featured , CES , USB , interface IP , eUSB2 , AI PC

Thermal Management in 3D-IC: Modeling Hotspots, Materials, & Cooling Strategies

As three-dimensional integrated circuit ( 3D-IC ) technology becomes the architectural…

• 7 min read
Celsius Thermal Solver , Allegro X AI , Voltus IC Power Integrity , Integrity 3D-IC Platform , advanced packaging , 3D-IC Technology

3D-IC Packaging: Wafer Stacking, Hybrid Bonding, and Interposer/RDL Techniques

The semiconductor industry is entering a new era where transistor scaling alone can…

• 7 min read
Celsius Thermal Solver , Voltus IC Power Integrity , Micro Bumps , hybrid bonding , advanced packaging , TSV , 3D-IC Technology

Through-Silicon Vias (TSVs): Interconnect Basics, Design Rules, and Performance

Through-silicon vias (TSVs) are one of the foundational enablers of modern three…

• 6 min read
Integrity 3D-IC Platform , advanced packaging , TSV , 3D-IC Technology

2.5D vs 3D-IC: Architecture Tradeoffs, and a Practical Selection

As traditional scaling slows and multi-die integration becomes the new engine of…

• 5 min read
architecture , 3D-IC , advanced packaging , vertical stacking , 3D-IC Technology , 2.5D

Cadence Adds 10 New VIP to Strengthen Verification IP Portfolio for AI Designs

Cadence has unveiled 10 Verification IP (VIP) for key emerging interfaces tuned for…

• 1 min read
news story , Verification IP , featured

3D-IC Design Tools: Cadence Workflows for Planning, Assembly, and Analysis

3D-IC design tools are becoming increasingly essential as the industry transitions…

• 6 min read
celsius , Virtuoso Studio , Tempus , Integrity 3D-IC Platform , 3D-IC , Voltus , Sigrity , Innovus Implementation , Allegro , clarity

Cadence, NVIDIA, and Solar Turbines Collaborate on AI Physics

Accelerated computing and advanced simulation technologies are changing the game…

• 4 min read
CFD , LLM , ai physics , model , simulation
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