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Featured

Samsung Foundry and Cadence Expand Infrastructure and Physical AI Solution

Today, AI infrastructure is driving a fundamental shift in semiconductor design.…

Corporate
Corporate 31 Jul 2026 • 7 min read
featured , chiplets , infrastructure ai , SF2P , physical ai

Cadence Certifies AI-Driven Reference Flows for Intel 18A-P and Intel 14A

The expanded Cadence-Intel Foundry collaboration delivers silicon-proven digital…

Corporate
Corporate 27 Jul 2026 • 3 min read
DAC , Design IP , featured , DAC 2026 , AI-Driven Design

The Autonomous Chip-to-System Engineer Has Arrived

How Cadence, in collaboration with NVIDIA, is building the industry's first silicon…

Corporate
Corporate 26 Jul 2026 • 4 min read
AuraStack AI Super Agent , DAC , featured , agentic ai , NVIDIA
Corporate News
Latest blogs

Day 1 Track Summary: CadenceLIVE Silicon Valley 2026

From Vision to Execution — AI-Driven Semiconductor Design at System Scale Day 1 at…

Vinod Khera 15 Apr 2026 • 6 min read
CadenceAI , chiplets , CadenceLIVE2026 , 3DIC , AIinEngineering , Semiconductor , SystemDesign , DigitalDesign , ChipDesign , DesignAutomation , verification

Beyond the Keynotes: Where Innovation Took a Tangible Form

On Day 1 of CadenceLIVE 2026 , the real depth of innovation unfolded on the exhibition…

Veena Parthan 15 Apr 2026 • 2 min read
CadenceAI , featured , Millennium M2000 , Customer Booths , TECHLeaders , Palladium Z3 , AI for design , cadencelive , ChipStack AI Super Agent , design for AI , Protium X3 , CadenceLIVE SiliconValley 2026 , networking

Key Takeaways from CadenceLIVE Silicon Valley Keynotes

CadenceLIVE Silicon Valley opened against the backdrop of an industry under rapid…

Corporate 15 Apr 2026 • 6 min read
CadenceLIVE Silicon Valley 2026 , featured , NVIDIA , AI for design , Anirudh Devgan , design for AI , intelligent system design , keynote

The Stage Is Set: Design for AI, AI for Design at CadenceLIVE Silicon Valley

Something is shifting in the world of silicon design, and you can feel it even before…

Reela Samuel 15 Apr 2026 • 4 min read
CadenceAI , featured , CadenceLIVE2026 , cadencelive silicon valley , Intelligent Systems , AI in chip design , Semiconductor Innovation , Electronic Design Automation , AIinEngineering , AI for design , System-Level Design , Semiconductor , design for AI , ChipDesign

CadenceLIVE Silicon Valley 2026: Powering AI, Transforming Design

Discover the future of electronics and system design at CadenceLIVE Silicon Valley…

Corporate 8 Apr 2026 • 3 min read
featured , NVIDIA , AI for design , broadcom , cadencelive , design for AI

Cadence at NVIDIA GTC 2026: From AI Factories to Molecular Discovery

At NVIDIA GTC 2026 , the industry conversation continued its shift beyond incremental…

Corporate 3 Apr 2026 • 4 min read
GTC2026 , AIEngineering , Engineering Simulation , featured , agentic ai , cadence , AI Factories , Molecular Discovery , semiconductor design , Digital Twins , HPC , AI , Accelerated Computing

VSORA: Redefining AI Inference with New Silicon Architecture

AI inference is rapidly becoming the largest and most demanding segment of the AI…

Tanushri Shah 2 Apr 2026 • 2 min read
data center , AI inference , designed with cadence

Cadence Recognized as a Platinum Employer on the Where You Work Matters List

We're proud to be named a 2026 Platinum Employer on the Where You Work Matters List…

Corporate 24 Mar 2026 • 1 min read
news story , featured , Careers , Where You Work Matters , life at cadence

The Engineering Workforce Multiplier: How Agentic AI Is Shaping Silicon Design

A virtual engineering organization coordinates reasoning and intent across design…

Corporate 16 Mar 2026 • 3 min read
ChipStack , featured , agentic ai , GTC , NVIDIA , ChipStack AI Super Agent

Reinventing Embedded Memory: How RAAAM Is Solving the SRAM Scaling Wall

As AI, automotive, and data centers continue to scale exponentially, one part of…

Tanushri Shah 12 Mar 2026 • 2 min read
spectre simulation , Virtuoso Studio , designed with cadence , Voltus

Cadence at DesignCon 2026: AI-Driven Design from Booth to Best Paper

When the industry's toughest engineering questions meet their sharpest minds, you…

Veena Parthan 12 Mar 2026 • 7 min read
featured , AI-Driven Design , DesignCon 2026

Powering the AI Supercycle: Design for AI and AI for Design

At the IEEE International Solid-State Circuits Conference (ISSCC) 2026 in San Francisco…

Reela Samuel 11 Mar 2026 • 4 min read
Multi-Agent Systems , featured , AI Supercycle , agentic ai , automation , AI-Driven Design , EDA , Digital Twins , Mental Model , AI

Reinventing Optical Computing: Neurophos’ Breakthrough in Photonic Transistors

Optical computing has been around since the late 1980s. The idea of using light instead…

Tanushri Shah 5 Mar 2026 • 2 min read
designed with cadence , photonics

The New Engineering Stack: Accelerated Computing and Agentic AI

Accelerated computing is now the primary design hardware platform for engineering…

Corporate 27 Feb 2026 • 3 min read
featured , agentic ai , GTC , NVIDIA

Cadence and NeoLogic Develop Energy-Efficient, High-Performance Processors

Cadence recently expanded its collaboration with Israeli company NeoLogic, which…

Corporate 26 Feb 2026 • 3 min read
designed with cadence

The New Engineering Stack at NVIDIA GTC 2026

Together, accelerated computing and agentic AI are redefining both the engine and…

Corporate 24 Feb 2026 • 4 min read
featured , agentic ai , GTC , NVIDIA , data center , digital twin , accelerated compute , AI

Celtro – Making Medical Implants Battery-Free

The average battery in a pacemaker occupies approximately 60 to 80% of its space…

Tanushri Shah 24 Feb 2026 • 1 min read
designed with cadence

Inside Cadence Digital Design and Signoff Excellence Event

If there was one unmistakable message from the Advancing Digital Design and Signoff…

Reela Samuel 22 Feb 2026 • 4 min read
Cadence Connect , Digital Design and Signoff Excellence

Pointcloud – Helping Machines View the World in 3D

For humans, understanding the world in three dimensions comes naturally. We can instantly…

Tanushri Shah 11 Feb 2026 • 1 min read
designed with cadence

From Cloud to Sensor: Neuronova on Building Truly Efficient AI Sensors

As AI moves from the cloud to the edge, power is becoming the new bottleneck, replacing…

Tanushri Shah 6 Feb 2026 • 6 min read
designed with cadence , AI

Neuronova – Scaling Ultra-Low-Power Edge Intelligence for Smart Devices

For decades, the data collection pipeline for sensors has been the exact same—measure…

Tanushri Shah 4 Feb 2026 • 2 min read
designed with cadence

Advancing ASK Portal Customer Support with Gen AI Features and an AI Assistant

Cadence has set a new benchmark in customer support excellence with its flagship…

Corporate 21 Jan 2026 • 2 min read
customer support , ASK Gen AI , ASK Portal , ASK AI Assitant , AI

Faster and Intelligent Customer Case Resolution with Cadence ASK Portal

Today, enterprise leaders are striving to provide exceptional customer experiences…

Corporate 14 Jan 2026 • 1 min read
Cadence ASK Portal , customer support

Cadence Celebrates 20 Years in Pune, Reinforces Long-Term R&D Commitment

Cadence, a global leader in electronic system design, is celebrating 20 years in…

Corporate 6 Jan 2026 • 1 min read
news story , featured , Cadence Culture

3D-IC Market Outlook: Technology Roadmaps, Readiness, and Design Implications

The 3D-IC market outlook is entering a decisive phase as the semiconductor industry…

Reela Samuel 22 Dec 2025 • 7 min read
cadence , advanced packaging , Cadence Integrity 3D IC Design Platform , 3D-IC Technology , 3D-IC Market Outlook

Cadence 3D-IC Success Stories: Faster Bandwidth, Lower Power, On-Time Tapeouts

As scaling at advanced nodes becomes increasingly constrained by cost, yield, and…

Reela Samuel 19 Dec 2025 • 6 min read
advanced packaging , tapeouts , hetrogenous integration , Cadence Integrity 3D IC Design Platform , 3D-IC Technology , faster bandwidth

3D-IC Test and Reliability: KGD Strategies, Access Architecture, & Failure Mode

3D-IC technology is redefining how advanced systems are built, but it also introduces…

Reela Samuel 18 Dec 2025 • 7 min read
Celsius Thermal Solver , Allegro X AI , Integrity 3D-IC Platform , kgd , advanced packaging , Yield management , multi-die 3d-ic solution , 3D-IC Technology

Cadence Tapes Out UCIe IP Solution at 64G Speeds on TSMC N3P Technology

Delivering the next wave of chiplet innovation, Cadence has successfully taped out…

Corporate 17 Dec 2025 • 2 min read
news story , ucie , featured , chiplets , TSMC N3P , 64G , chiplet connectivity
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