Featured

Samsung Foundry and Cadence Expand Infrastructure and Physical AI Solution

Today, AI infrastructure is driving a fundamental shift in semiconductor design.…

Corporate
• 7 min read
featured , chiplets , infrastructure ai , SF2P , physical ai

Cadence Certifies AI-Driven Reference Flows for Intel 18A-P and Intel 14A

The expanded Cadence-Intel Foundry collaboration delivers silicon-proven digital…

Corporate
• 3 min read
DAC , Design IP , featured , DAC 2026 , AI-Driven Design

The Autonomous Chip-to-System Engineer Has Arrived

How Cadence, in collaboration with NVIDIA, is building the industry's first silicon…

Corporate
• 4 min read
AuraStack AI Super Agent , DAC , featured , agentic ai , NVIDIA
Corporate News
Latest blogs

3D-IC in AI, HPC, and 5G: Bandwidth, Latency, and Energy per Bit Advantages

3D-IC technology is rapidly becoming the backbone of next-generation compute systems…

• 5 min read
Celsius Thermal Solver , Adavanced Packaging , Allegro X AI , Integrity 3D-IC Platform , AI-Driven Design , HPC , 3D-IC Technology , bandwidth , latency , Clarity 3D Solver , Energy per Bit

Industry’s First End-to-End eUSB2V2 Demo for Edge AI and AI PCs at CES

Since their debut in 2023, AI PCs have taken the market by storm. Gartner projects…

• 4 min read
news story , eUSB2v2 , Edge AI , Design IP , featured , CES , USB , interface IP , eUSB2 , AI PC

Thermal Management in 3D-IC: Modeling Hotspots, Materials, & Cooling Strategies

As three-dimensional integrated circuit ( 3D-IC ) technology becomes the architectural…

• 7 min read
Celsius Thermal Solver , Allegro X AI , Voltus IC Power Integrity , Integrity 3D-IC Platform , advanced packaging , 3D-IC Technology

3D-IC Packaging: Wafer Stacking, Hybrid Bonding, and Interposer/RDL Techniques

The semiconductor industry is entering a new era where transistor scaling alone can…

• 7 min read
Celsius Thermal Solver , Voltus IC Power Integrity , Micro Bumps , hybrid bonding , advanced packaging , TSV , 3D-IC Technology

Through-Silicon Vias (TSVs): Interconnect Basics, Design Rules, and Performance

Through-silicon vias (TSVs) are one of the foundational enablers of modern three…

• 6 min read
Integrity 3D-IC Platform , advanced packaging , TSV , 3D-IC Technology

2.5D vs 3D-IC: Architecture Tradeoffs, and a Practical Selection

As traditional scaling slows and multi-die integration becomes the new engine of…

• 5 min read
architecture , 3D-IC , advanced packaging , vertical stacking , 3D-IC Technology , 2.5D

Cadence Adds 10 New VIP to Strengthen Verification IP Portfolio for AI Designs

Cadence has unveiled 10 Verification IP (VIP) for key emerging interfaces tuned for…

• 1 min read
news story , Verification IP , featured

3D-IC Design Tools: Cadence Workflows for Planning, Assembly, and Analysis

3D-IC design tools are becoming increasingly essential as the industry transitions…

• 6 min read
celsius , Virtuoso Studio , Tempus , Integrity 3D-IC Platform , 3D-IC , Voltus , Sigrity , Innovus Implementation , Allegro , clarity

Cadence, NVIDIA, and Solar Turbines Collaborate on AI Physics

Accelerated computing and advanced simulation technologies are changing the game…

• 4 min read
CFD , LLM , ai physics , model , simulation

What Is 3D-IC Technology? Fundamentals, Architecture, and Design Concepts

As process nodes continue to advance into the sub-micron era, the limitations of…

• 5 min read
Integrity 3D-IC Platform , chiplet , 3D-IC , advanced packaging , vertical stacking , 3D-IC Technology

Jasper User Group 2025: A Recap of Innovations and Insights

The Jasper User Group 2025, the annual must-attend event for the formal community…

• 3 min read
Jasper User Group , Jasper Formal Verification Platform , GenAI , verification

Fortune & Great Place To Work Name Cadence to 2025 World’s Best Workplaces List

Great Place To Work® and Fortune magazine have honored Cadence as one of the Fortune…

• 2 min read
news story , Culture , featured

Spectre FX Simulator Cuts Intrinsic Semi’s Memory Verification Time by 4X

Intrinsic Semiconductor Technologies, a company transforming the semiconductor industry…

• 2 min read
newstory , featured , spectre fx , Instrinsic Semi , verification

Cadence Welcomes ChipStack

ChipStack, a leading startup providing agentic AI solutions for chip verification…

• 1 min read
ChipStack , featured , agentic ai , Xcelium Logic Simulator , AI-Driven Verification

Accelerating System Design with Real-Time Simulation, Powered by AI Physics

Rising demand for AI infrastructure is driving faster innovation and smarter use…

• 4 min read
CFD , featured , NVIDIA , accelerated compute , millennium , AI

Don’t Miss the 2025 North America Open Meeting!

Join Visionaries, Discover Breakthrough Tech, and Power Your Next Big Idea Are you…

• 1 min read
featured , innovation , Beta CAE , event , AI , simulation

Next Steps for the Cadence and SkyWater MPW Service

At Cadence, we are dedicated to nurturing future innovators. Our commitment to education…

• 6 min read
news story , featured , Cadence Academic Network , SKY130

New Ultra-Fast Debug Solution for Palladium Emulation with Verisium Debug

Verification engineers continually report that up to 70% of the total engineering…

• 2 min read
news story , featured , verisium , AI

Cadence Recognized as TSMC OIP Partner of the Year at 2025 OIP Ecosystem Forum

The semiconductor industry thrives on collaboration, and few pairings exemplify this…

• 2 min read
featured , cadence , OIP Partner of the Year , AI-Driven Design , TSMC , OIP Award

Danfoss Amplifies PCB Design with Cadence Allegro X AI

Danfoss is a Danish family-owned multinational company with a focus on sustainability…

• 1 min read
designed with cadence

AI Infra Summit Highlights: Cadence's Unique Design for AI and AI for Design

The AI Infra Summit 2025 was a great experience that left attendees buzzing with…

• 7 min read
featured , data center , AI Infra Summit 2025 , digital twin , AI for design , Cadence Reality Digital Twin Platform , design for AI , post event insights

Ambarella Redefines Edge AI Performance with Cadence

Ambarella stands at the forefront of edge AI processing, pioneering low-power, high…

• 4 min read
news story , Edge AI , featured , Ambarella

Explore Photonics and Quantum Technologies at CadenceCONNECT 2025

The intersection of photonics and quantum computing marks a pivotal moment in advancing…

• 1 min read
Quantum States , featured , cadenceconnect , photonics , Quantum Technology

Vaire Computing – Near-Zero Energy Computing for Agentic AI

The demand for AI is on the rise, with agentic AI being the next frontier. However…

• 2 min read
agentic ai , designed with cadence

Cadence at the TSMC OIP: Pioneering the Future of Semiconductor Design

The semiconductor industry stands at a pivotal moment. As we push toward more advanced…

• 3 min read
OIP , featured , 3D-IC , 3DIC , TSMC , AI

Building a Future Beyond Boundaries with Honda and Cadence

We at Cadence are proud to be a long-term partner of Honda R&D (HGRX), and our collaboration…

• 6 min read
Automotive , featured , physical ai , automotive electronics , AI

The Birth of the Integrated Circuit

On September 12, 1958, in a modest lab in Dallas, Texas, the seeds of a digital revolution…

• 3 min read
IC , chip , chip design automation , IC design

VoxelSensors: Enhancing AI Agents Through Unique Perception Systems with Cadence

AI agents are rapidly heading towards offering us personal assistance in our daily…

• 2 min read
designed with cadence
Blog - Title