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Trusted Autonomy with Cadence Super Agents & NVIDIA Open Agent Safety Platform

Cadence AI Super Agents bring engineering trusted autonomy to semiconductor workflows…

Corporate
• 8 min read
featured , agentic ai , autonomy , NVIDIA , Super Agent

15 Years of Trust: Honda, Cadence, and the Future of CFD

What does it take to transform promising research into simulation technology that…

Corporate
• 3 min read
CFD , featured , Cascade Technologies , Aerodynamics , Honda

Accelerate Chip Design with Arm Architecture: Cadence EDA Tools on AWS Graviton

Cadence has qualified its full EDA flow on Arm-based AWS Graviton CPUs, and Annapurna…

Corporate
• 4 min read
news story , Innovus+ Place and Route , Jasper Formal Verification Platform , Cadence Oncloud , featured
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Latest blogs

Pointcloud – Helping Machines View the World in 3D

For humans, understanding the world in three dimensions comes naturally. We can instantly…

• 1 min read
designed with cadence

From Cloud to Sensor: Neuronova on Building Truly Efficient AI Sensors

As AI moves from the cloud to the edge, power is becoming the new bottleneck, replacing…

• 6 min read
designed with cadence , AI

Neuronova – Scaling Ultra-Low-Power Edge Intelligence for Smart Devices

For decades, the data collection pipeline for sensors has been the exact same—measure…

• 2 min read
designed with cadence

Advancing ASK Portal Customer Support with Gen AI Features and an AI Assistant

Cadence has set a new benchmark in customer support excellence with its flagship…

• 2 min read
customer support , ASK Gen AI , ASK Portal , ASK AI Assitant , AI

Faster and Intelligent Customer Case Resolution with Cadence ASK Portal

Today, enterprise leaders are striving to provide exceptional customer experiences…

• 1 min read
Cadence ASK Portal , customer support

Cadence Celebrates 20 Years in Pune, Reinforces Long-Term R&D Commitment

Cadence, a global leader in electronic system design, is celebrating 20 years in…

• 1 min read
news story , featured , Cadence Culture

3D-IC Market Outlook: Technology Roadmaps, Readiness, and Design Implications

The 3D-IC market outlook is entering a decisive phase as the semiconductor industry…

• 7 min read
cadence , advanced packaging , Cadence Integrity 3D IC Design Platform , 3D-IC Technology , 3D-IC Market Outlook

Cadence 3D-IC Success Stories: Faster Bandwidth, Lower Power, On-Time Tapeouts

As scaling at advanced nodes becomes increasingly constrained by cost, yield, and…

• 6 min read
advanced packaging , tapeouts , hetrogenous integration , Cadence Integrity 3D IC Design Platform , 3D-IC Technology , faster bandwidth

3D-IC Test and Reliability: KGD Strategies, Access Architecture, & Failure Mode

3D-IC technology is redefining how advanced systems are built, but it also introduces…

• 7 min read
Celsius Thermal Solver , Allegro X AI , Integrity 3D-IC Platform , kgd , advanced packaging , Yield management , multi-die 3d-ic solution , 3D-IC Technology

Cadence Tapes Out UCIe IP Solution at 64G Speeds on TSMC N3P Technology

Delivering the next wave of chiplet innovation, Cadence has successfully taped out…

• 2 min read
news story , ucie , featured , chiplets , TSMC N3P , 64G , chiplet connectivity

3D-IC in AI, HPC, and 5G: Bandwidth, Latency, and Energy per Bit Advantages

3D-IC technology is rapidly becoming the backbone of next-generation compute systems…

• 5 min read
Celsius Thermal Solver , Adavanced Packaging , Allegro X AI , Integrity 3D-IC Platform , AI-Driven Design , HPC , 3D-IC Technology , bandwidth , latency , Clarity 3D Solver , Energy per Bit

Industry’s First End-to-End eUSB2V2 Demo for Edge AI and AI PCs at CES

Since their debut in 2023, AI PCs have taken the market by storm. Gartner projects…

• 4 min read
news story , eUSB2v2 , Edge AI , Design IP , featured , CES , USB , interface IP , eUSB2 , AI PC

Thermal Management in 3D-IC: Modeling Hotspots, Materials, & Cooling Strategies

As three-dimensional integrated circuit ( 3D-IC ) technology becomes the architectural…

• 7 min read
Celsius Thermal Solver , Allegro X AI , Voltus IC Power Integrity , Integrity 3D-IC Platform , advanced packaging , 3D-IC Technology

3D-IC Packaging: Wafer Stacking, Hybrid Bonding, and Interposer/RDL Techniques

The semiconductor industry is entering a new era where transistor scaling alone can…

• 7 min read
Celsius Thermal Solver , Voltus IC Power Integrity , Micro Bumps , hybrid bonding , advanced packaging , TSV , 3D-IC Technology

Through-Silicon Vias (TSVs): Interconnect Basics, Design Rules, and Performance

Through-silicon vias (TSVs) are one of the foundational enablers of modern three…

• 6 min read
Integrity 3D-IC Platform , advanced packaging , TSV , 3D-IC Technology

2.5D vs 3D-IC: Architecture Tradeoffs, and a Practical Selection

As traditional scaling slows and multi-die integration becomes the new engine of…

• 5 min read
architecture , 3D-IC , advanced packaging , vertical stacking , 3D-IC Technology , 2.5D

Cadence Adds 10 New VIP to Strengthen Verification IP Portfolio for AI Designs

Cadence has unveiled 10 Verification IP (VIP) for key emerging interfaces tuned for…

• 1 min read
news story , Verification IP , featured

3D-IC Design Tools: Cadence Workflows for Planning, Assembly, and Analysis

3D-IC design tools are becoming increasingly essential as the industry transitions…

• 6 min read
celsius , Virtuoso Studio , Tempus , Integrity 3D-IC Platform , 3D-IC , Voltus , Sigrity , Innovus Implementation , Allegro , clarity

Cadence, NVIDIA, and Solar Turbines Collaborate on AI Physics

Accelerated computing and advanced simulation technologies are changing the game…

• 4 min read
CFD , LLM , ai physics , model , simulation

What Is 3D-IC Technology? Fundamentals, Architecture, and Design Concepts

As process nodes continue to advance into the sub-micron era, the limitations of…

• 5 min read
Integrity 3D-IC Platform , chiplet , 3D-IC , advanced packaging , vertical stacking , 3D-IC Technology

Jasper User Group 2025: A Recap of Innovations and Insights

The Jasper User Group 2025, the annual must-attend event for the formal community…

• 3 min read
Jasper User Group , Jasper Formal Verification Platform , GenAI , verification

Fortune & Great Place To Work Name Cadence to 2025 World’s Best Workplaces List

Great Place To Work® and Fortune magazine have honored Cadence as one of the Fortune…

• 2 min read
news story , Culture , featured

Spectre FX Simulator Cuts Intrinsic Semi’s Memory Verification Time by 4X

Intrinsic Semiconductor Technologies, a company transforming the semiconductor industry…

• 2 min read
newstory , featured , spectre fx , Instrinsic Semi , verification

Cadence Welcomes ChipStack

ChipStack, a leading startup providing agentic AI solutions for chip verification…

• 1 min read
ChipStack , featured , agentic ai , Xcelium Logic Simulator , AI-Driven Verification

Accelerating System Design with Real-Time Simulation, Powered by AI Physics

Rising demand for AI infrastructure is driving faster innovation and smarter use…

• 4 min read
CFD , featured , NVIDIA , accelerated compute , millennium , AI

Don’t Miss the 2025 North America Open Meeting!

Join Visionaries, Discover Breakthrough Tech, and Power Your Next Big Idea Are you…

• 1 min read
featured , innovation , Beta CAE , event , AI , simulation

Next Steps for the Cadence and SkyWater MPW Service

At Cadence, we are dedicated to nurturing future innovators. Our commitment to education…

• 6 min read
news story , featured , Cadence Academic Network , SKY130

New Ultra-Fast Debug Solution for Palladium Emulation with Verisium Debug

Verification engineers continually report that up to 70% of the total engineering…

• 2 min read
news story , featured , verisium , AI
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