Solutions to Maximize Data Center Performance Featured at OCP Global Summit 2024

5 Nov 2024 • 4 minute read

The demand for higher compute performance, energy efficiency, and faster time-to-market drove the conversations at this year's Open Compute Project (OCP) Global Summit in San Jose, California. It was the scene of showcasing groundbreaking innovations, expert-led sessions, and networking opportunities to drive the future of data center technology. For those who didn't get to attend or stop by our booth, here's a recap of Cadence's comprehensive solutions that enable next-generation compute technology, AI data center design, analysis, and optimization.

Optimized Data Center Design and Operations

As the data center community increasingly faces demands for enhanced efficiency, thermal management, sustainability, and performance optimization, data center operators, IT managers, and executives are looking for solutions to these challenges. At the Cadence booth, attendees explored the Cadence Reality Digital Twin Platform and Celsius EC Solver. These technologies are pivotal in achieving high-performance standards for AI data centers, providing advanced digital twin modeling capabilities that redefine next-generation data center design and operation. The Celsius EC Solver demonstration showed how it solves challenging thermal and electronics cooling management problems with precision and speed.

CadenceCONNECT: Take the Heat Out of Your AI Data Center

Cadence hosted a networking reception on October 16 titled "Take the Heat Out of Your AI Data Center." In today's AI era, managing the heat generated by high-density computing environments is more critical than ever. This reception offered insights into current and emerging data center technologies, digital twin cooling strategies that deliver energy-saving operations, and a chance to engage with industry leaders, Cadence experts, and peers to explore the latest cooling, AI, and GPU acceleration advancements. Here's a recap:

Researcher, author, and entrepreneur Dr. Jon Koomey highlighted the inefficiency of data centers in his talk "The Rise of Zombie Data Centers," noting that 20-30% of their capacity is stranded and unused. He advocated for organizational changes and technological solutions like digital twins to reduce wasted energy and improve computational effectiveness as AI deployments increase.
In "A New Millennium in Multiphysics System Analysis," Cadence Corporate VP Ben Gu explained the company's significant strides in multiphysics system analysis, evolving from chip simulation to a broader application of computational software for simulating various physical systems, including entire data centers. He noted that the latest Cadence venture, a digital twin platform for data center optimization, opened the opportunity to use simulation technology to optimize the efficiency of data centers.
Senior Software Engineering Group Director Albert Zeng highlighted the Cadence Reality DC suite's ability to transform data center operations through simulation, emphasizing its multi-phase engine for optimal thermal performance and the integration of AI capabilities for enhanced design and management.
A panel discussion titled "Turning AI Factory Blueprints into Reality at the Speed of Light" featured industry experts from NVIDIA, Norman Wright Precision Environmental and Power, NV5, Switch Data Centers, and Cadence, who explored the evolving requirements and multidimensional challenges of AI factories, emphasizing the need for collaboration across the supply chain to achieve high-performing and sustainable data centers.

Watch the highlights.

Transforming Designs from Chips to Data Centers

The OCP Global Summit 2024 has reaffirmed its status as a pivotal event for data center professionals seeking to stay at the forefront of technological advancements. Cadence's contributions, from groundbreaking digital twin technologies to innovative cooling strategies, have shed light on the path forward for efficient, sustainable data centers. For data center professionals, IT managers, and engineers, the insights gained at this summit are invaluable in navigating the challenges and opportunities presented by the burgeoning AI era.

Partnering with Arm

Arm Total Design

Cadence is a member of the Arm Total Design program. At an invitation-only special Arm event, Cadence's VP of Research and Development, Lokesh Korlipara, delivered a presentation focusing on data center challenges and design solutions with Arm Neoverse Compute Subsystem (CSS). The session highlighted:

Efficient integration of Arm Neoverse CSS into system on chips (SoCs) with pre-integrated connectivity IP
Performance analysis and verification of the Neoverse CSS integration into the SoC through Cadence's System VIP verification suite and automated testbench creation, enhancing both quality and productivity
Jumpstarting designs through Cadence's collaboration with Arm for 3D-IC system planning, chiplets, and interposers
Design Services readiness and global scale to support and/or deliver the most demanding Arm Neoverse CSS-based SoC design projects

Cadence Supports Arm CSS in Arm Booth

During the event, Cadence conducted a demo in the Arm booth that showcased the Cadence System VIP verification suite. The demo highlighted automated testbench creation and performance analysis for integrating the Arm CSS into SoCs while enhancing verification quality and productivity.

Summary

Cadence offers data center solutions for designing everything from the compute and networking chips to the board, racks, data centers, and campuses. Stay connected with Cadence and other industry leaders to continue exploring the innovations set to redefine the future of data centers.