Cadence® system design and verification solutions, integrated under our System Development Suite, provide the simulation, acceleration, emulation, and management capabilities.
System Development Suite Related Products A-Z
Cadence® digital design and signoff solutions provide a fast path to design closure and better predictability, helping you meet your power, performance, and area (PPA) targets.
Full-Flow Digital Solution Related Products A-Z
Cadence® custom, analog, and RF design solutions can help you save time by automating many routine tasks, from block-level and mixed-signal simulation to routing and library characterization.
Overview Related Products A-Z
Driving efficiency and accuracy in advanced packaging, system planning, and multi-fabric interoperability, Cadence® package implementation products deliver the automation and accuracy.
Cadence® PCB design solutions enable shorter, more predictable design cycles with greater integration of component design and system-level simulation for a constraint-driven flow.
An open IP platform for you to customize your app-driven SoC design.
Comprehensive solutions and methodologies.
Helping you meet your broader business goals.
A global customer support infrastructure with around-the-clock help.
24/7 Support - Cadence Online Support
Locate the latest software updates, service request, technical documentation, solutions and more in your personalized environment.
Cadence offers various software services for download. This page describes our offerings, including the Allegro FREE Physical Viewer.
The Cadence Academic Network helps build strong relationships between academia and industry, and promotes the proliferation of leading-edge technologies and methodologies at universities renowned for their engineering and design excellence.
Participate in CDNLive
A huge knowledge exchange platform for academia to network with industry. We are looking for academic speakers to talk about their research to the industry attendees at the Academic Track at CDNLive EMEA and Silicon Valley.
Come & Meet Us @ Events
A huge knowledge exchange platform for academia. We are looking for academic speakers to talk about their research to industry attendees.
Americas University Software Program
Join the 250+ qualified Americas member universities who have already incorporated Cadence EDA software into their classrooms and academic research projects.
EMEA University Software Program
In EMEA, Cadence works with EUROPRACTICE to ensure cost-effective availability of our extensive electronic design automation (EDA) tools for non-commercial activities.
Apply Now For Jobs
If you are a recent college graduate or a student looking for internship. Visit our exclusive job search page for interns and recent college graduate jobs.
Cadence is a Great Place to do great work
Learn more about our internship program and visit our careers page to do meaningful work and make a great impact.
Get the most out of your investment in Cadence technologies through a wide range of training offerings.
Overview All Courses Asia Pacific EMEANorth America
Instructor-led training [ILT] are live classes that are offered in our state-of-the-art classrooms at our worldwide training centers, at your site, or as a Virtual classroom.
Online Training is delivered over the web to let you proceed at your own pace, anytime and anywhere.
Exchange ideas, news, technical information, and best practices.
The community is open to everyone, and to provide the most value, we require participants to follow our Community Guidelines that facilitate a quality exchange of ideas and information.
It's not all about the technlogy. Here we exchange ideas on the Cadence Academic Network and other subjects of general interest.
Cadence is a leading provider of system design tools, software, IP, and services.
Get email delivery of the Cadence blog featured here
Design teams concerned about managing two different power formats will find some relief July 26, 2009. That’s the date of a Low Power Coalition (LPC) workshop that will present some ongoing work aimed at interoperability between the Common Power Format (CPF) and P1801 (Unified Power Format). The workshop will also unveil a new idea -- an Open Power Data Model that could potentially support both formats.
The user-driven LPC, managed by the Silicon Integration Initiative (Si2), not only oversees CPF but has also defined a reference flow for low-power design and is tackling ESL power modeling issues. That will all be explained at the free workshop, which is scheduled for the Sunday before the Design Automation Conference at the Moscone Convention Center in San Francisco from 1:00 to 4:30 p.m.
One session at the workshop will report plans and goals towards interoperability between CPF and P1801. A summary of the goals can be found in a CPF 1.2 roadmap presentation on the Si2 web site. They include identifying a set of commands and options that can be used in both CPF and P1801, resolving ambiguities bewteen compatible subsets of the formats, and providing name mapping between CPF and P1801 objects.
Qi Wang, senior architect at Cadence and a presenter at the workshop, said the basic idea is to define an interoperable subset of the features supported by both CPF and P1801. “If you keep within that subset, potential issues with interoperability will be minimized,” he said. Further, the subset will make it easier to develop translators between CPF and UPF. Work on the subset is ongoing and may be completed later this year.
Another possible approach to interoperability is represented by a proposed power intent data model and associated API. Called Open Power Data Model, it’s intended to work with the OpenAccess (OA) API and data model. The intent is to allow design teams to build automated low-power flows regardless of the power formats they use.
“The notion is that the formats will become an input/output way to get into the data model, in the same way that LEF/DEF is an input/output format into OA,” said Nick English, vice president of development at Si2. The result? “You’ll get out of the format wars. And you’ll be able to build an entire power-aware flow such that each tool can access the power information using OA.”
Sumit DasGupta, senior vice president of engineering at Si2, described the data model as a “neutral container” that can accept different file formats. But it will take some time to implement. He said that LPC members have been doing a lot of “deliberate thinking” about how to resolve syntactic and semantic differences between the two power formats. Also, the data model doesn’t determine how the tools will actually make use of the power data.
Finally, the workshop will include a presentation about ESL power modeling. LPC’s work in this area follows its publication of a low-power reference flow. The development of the flow exposed a lack of power models, particularly at the system level. A Modeling Working Group was established to tackle the problem. Jerry Frenkil of Sequence Design will present its latest work.
A “what’s next in low power” panel promises to be interesting as well. One topic that’s likely to come up is adaptive power management, in which chips can evaluate the external environment and scale voltage or frequency accordingly.
In addition to the low-power workshop, Si2 is offering a free workshop on DFM challenges at 45 nm and below. That workshop will be held Monday July 27 from 1:00 pm to 3:00 pm at the Moscone Convention Center.