Cadence® system design and verification solutions, integrated under our System Development Suite, provide the simulation, acceleration, emulation, and management capabilities.
System Development Suite Related Products A-Z
Cadence® digital design and signoff solutions provide a fast path to design closure and better predictability, helping you meet your power, performance, and area (PPA) targets.
Full-Flow Digital Solution Related Products A-Z
Cadence® custom, analog, and RF design solutions can help you save time by automating many routine tasks, from block-level and mixed-signal simulation to routing and library characterization.
Overview Related Products A-Z
Driving efficiency and accuracy in advanced packaging, system planning, and multi-fabric interoperability, Cadence® package implementation products deliver the automation and accuracy.
Cadence® PCB design solutions enable shorter, more predictable design cycles with greater integration of component design and system-level simulation for a constraint-driven flow.
An open IP platform for you to customize your app-driven SoC design.
Comprehensive solutions and methodologies.
Helping you meet your broader business goals.
A global customer support infrastructure with around-the-clock help.
24/7 Support - Cadence Online Support
Locate the latest software updates, service request, technical documentation, solutions and more in your personalized environment.
Cadence offers various software services for download. This page describes our offerings, including the Allegro FREE Physical Viewer.
The Cadence Academic Network helps build strong relationships between academia and industry, and promotes the proliferation of leading-edge technologies and methodologies at universities renowned for their engineering and design excellence.
Participate in CDNLive
A huge knowledge exchange platform for academia to network with industry. We are looking for academic speakers to talk about their research to the industry attendees at the Academic Track at CDNLive EMEA and Silicon Valley.
Come & Meet Us @ Events
A huge knowledge exchange platform for academia. We are looking for academic speakers to talk about their research to industry attendees.
Americas University Software Program
Join the 250+ qualified Americas member universities who have already incorporated Cadence EDA software into their classrooms and academic research projects.
EMEA University Software Program
In EMEA, Cadence works with EUROPRACTICE to ensure cost-effective availability of our extensive electronic design automation (EDA) tools for non-commercial activities.
Apply Now For Jobs
If you are a recent college graduate or a student looking for internship. Visit our exclusive job search page for interns and recent college graduate jobs.
Cadence is a Great Place to do great work
Learn more about our internship program and visit our careers page to do meaningful work and make a great impact.
Get the most out of your investment in Cadence technologies through a wide range of training offerings.
Overview All Courses Asia Pacific EMEANorth America
Instructor-led training [ILT] are live classes that are offered in our state-of-the-art classrooms at our worldwide training centers, at your site, or as a Virtual classroom.
Online Training is delivered over the web to let you proceed at your own pace, anytime and anywhere.
Exchange ideas, news, technical information, and best practices.
The community is open to everyone, and to provide the most value, we require participants to follow our Community Guidelines that facilitate a quality exchange of ideas and information.
It's not all about the technlogy. Here we exchange ideas on the Cadence Academic Network and other subjects of general interest.
Cadence is a leading provider of system design tools, software, IP, and services.
Get email delivery of the Cadence blog featured here
Lip-Bu Tan, Cadence president and CEO, is excited about ongoing innovation within the electronics industry - but he's also aware of challenges such as advanced node lithography, complexity, time-to-market, and rising design costs. In a keynote speech at the CDNLive Silicon Valley conference March 12, 2013, Tan spoke passionately about market drivers, challenges, and how Cadence is responding.
The CDNLive Silicon Valley user conference runs March 12-13, and it drew over 800 attendees for around 100 technical sessions, mostly given by Cadence customers or partners. Keynote speeches were given by Lip-Bu Tan; Young Sohn, president and chief strategy officer of Device Solutions at Samsung (blog post here); and Martin Lund, vice president of R&D for the Cadence SoC Realization Group (blog post here). For blogs, tweets, pictures and reports from the conference, see the CDNLive Multimedia page.
Tan began his keynote by noting the "exciting times" we live in, with new, innovative products that improve quality of life. He talked about 3D TV (which he hopes to experience without glasses), wearable medical devices, Google Glass, and more. He then discussed major market drivers including mobility, social media, cloud computing, and the "Internet of things."
Exabytes of Data
The mobile Internet is really taking off, Tan noted, and that will involve the transfer of massive amounts of data. He showed some data from Cisco that predicts a 66% compound annual growth rate in mobile data traffic from 2012 to 2017, culminating in 11.2 Exabytes/month by 2017 (an Exabyte is one quintillion bytes). Much of this data is going into the cloud, and one result is a tremendous growth in data centers.
Tan cited more big numbers to illustrate the spectacular growth of electronics content:
Semiconductors are at the heart of all electronic devices, Tan noted - not just the "Internet of things" but also the cloud, your car, and home entertainment. "It is very important for us to help the industry develop all these new products, so we and our kids can enjoy quality of life and get any data we want at our fingertips."
Challenges to Solve
However, some challenges come along with the excitement. One challenge is that lithography is "hitting the wall" with upcoming process nodes. Tan noted there are several ways to work around it - FinFETs, 3D-ICs, and massive parallelism. He also said he is keeping a "very close eye" on extreme ultraviolet (EUV) lithography and expects that at some point it will provide a "breakthrough." Meanwhile, Tan said, "we always find a way to solve problems - I am confident we will find a way to do it."
A second challenge is design complexity, which is driven by factors including hardware/software co-development, mixed-signal design, and low power design. A third challenge is meeting time-to-market demands, given that these times are growing much shorter.
A fourth challenge is reducing semiconductor design costs. "This is very important to me because as a VC [venture capitalist], I used to know 30 guys investing in semiconductors. Now I can't even count five. That is very depressing. Big companies I talk to are worried that 10 years from now, there will be no companies to buy and no new technology coming up."
How Cadence Can Help
Tan listed several ways that "Cadence can help you build great products." First, he said, Cadence will "continue to drive the roadmap on advanced nodes" including 20nm, 16nm, 14nm, and 10nm.
This will require a lot of collaboration. Tan mentioned the recent collaboration between Cadence, ARM and Samsung to design a 14nm FinFET test chip including an ARM Cortex-A7 (see my previous blog post here). He also noted the deep collaboration between Cadence and TSMC on the development of the TSMC chip-on-wafer-on-substrate (CoWoS) process for 3D-ICs (blog post here).
Cadence is also driving hard on IP solutions, Tan said, with a focus on "silicon proven, high quality" IP. Following the 2010 Denali purchase, Cadence is strong in memory IP and a leader in verification IP. In February 2013 Cadence announced an agreement to purchase Cosmic Circuits, which adds a "fabulous team" along with analog IP.
On March 11, 2013, Cadence announced an agreement to acquire Tensilica, a successful provider of Dataplane Processor Units (DPUs) that can be customized for a variety of embedded data and signal processing applications. "One thing that's really exciting," Tan said, "is that it's not traditional DSP, it's a DPU and they have a programmable capability. We think the combination of Tensilica with Cadence tools and some of our IP will provide a very strong solution."
The real beneficiary of these activities, Tan said, is the customer's customer - the end users of the products that Cadence tools help create. To this end he talked about the success of the GoPro camera (Tan is an investor in the company) and how it was built using Cadence tools and IP. This kind of success just might excite some college grads and get them to work for an EDA or fabless semiconductor company. "We'd love to have talent like that," Tan said.
Related Blog Posts
Samsung CDNLive Keynote: Innovation and Challenges in the Post-PC Era
Martin Lund CDNLive Keynote: Why SoCs Need "Application Optimized" IP