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  3. Moving Wire Bond in APD16.2 results disconnect Wire and...

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Moving Wire Bond in APD16.2 results disconnect Wire and it's Bond Finger

Alice
Alice over 16 years ago

Hi all,

 I face problem when I want to move the wire bond in APD16.2. After the first nove of the wire bond, when I want to make second time move, the Bond Fingers will shove togather but the wires stay as it is. It seems like a disconnect between BF and wires. Does anyone know how to solve this ?

 Thanks,

Alice

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  • Alice
    Alice over 16 years ago

    Hello Tyler,

    I did as per your recommendation, and it works! How great it is!! Also, is true if wire is long enought I won't see this problem.

     I really don't understand why need to have unit as microns to make the Design Intergrity WB checks work. It seems like a major issue for APD 16.2. I need to run Intergrity checks everytime there's disconnect moved WB. I did feedback to Cadence and the feedback is RND will look in to it.

    Anyway, really appreaciate your temporary solution as I may proceed with the design.

    Thank you very much. =)

    Regards,

    Alice 

     

     

     

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  • Tyler
    Tyler over 16 years ago

    I'm glad to hear it works! That's great, Alice!

    Also, I'm reasonably sure that the design integrity check bug is scheduled for fix very soon. Last I talked to R&D, the fix was ready, but needed to be built into the next patch for customer release, so we should see it available in the next 2-3 weeks or so. 

    The disconnect on moving the wirebond is still actively being looked at, so I don't know when that will be ready for release.

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