IMS Excitations

After a two year hiatus, the International Microwave Symposium (IMS), the world's largest conference and exhibition focused on microwave technology and techniques, will return in full force as a live event. For those of us RF types who have been attending for decades (yes, I said decades), this is a very welcome occasion to catch up with old friends, former colleagues and customers. In addition to the world class conference on the latest and greatest RF to millimeter-wave research papers, the exhibition floor promises to highlight the most recent innovations from component and system manufacturers targeting both commercial and aerospace/defense applications. This is also the first year that AWR will be attending IMS since its acquisition by Cadence in 2020, and we have much to talk about!

In particular, we will showcase the latest capabilities in design, analysis and implementation of RF products with EDA software, focusing on multi-physics solver integration for large scale 3D EM design and verification, thermal analysis and workflow interoperability for RFICs, MMICs, Modules, and PCB development. Come meet with Cadence experts in booth #5050 to learn about the latest features in AWR Design Environment (Microwave Office), Virtuoso RF Solution, Allegro® PCB Editor, Clarity 3D Solver, Celsius Thermal Solver, and EMX Planar 3D Solver for circuit simulation, EM and thermal analysis and implementation flows across RFICs/MMICs, packages/modules and PCBs, including:

• Accelerated GaAs/GaN and Si MMIC development 
• RF/microwave design through PCB implementation 
• Comprehensive communication and radar system design and development - from concept through measurement
• Next-generation 3D electromagnetic (EM) and thermal analysis technologies
• RFIC and RF module co-design flows with Virtuoso RF Solution
• Simultaneous editing in VRF of multiple ICs and SiP/modules across technologies 
• Workflow interoperability between AWR Design Environment, Virtuoso design platform, and Allegro® PCB design tools 

Participate in Cadence workshops and MicroApps at IMS 2022 presenting timely topics:

• Workshop: New Workflows for Integrated 5G Phased Array Antenna System Design
• Workshop: From Design to Manufacturing: mmWave IC and Heterogeneous RF Integration in One Design Flow

• MicroApp: Virtuoso PDK Support in Microwave Office for Si MMIC Design and Heterogenous Technology Integration
• MicroApp: Addressing Performance and Reliability Concerns with Thermal Analysis for RF Power Applications
• MicroApp: Passive Circuit Analysis and Model Development for Silicon Chips Using EMX 3D Planar Solver

And many in-booth presentations from Cadence customers and partners such as 3D Glass, Rohde & Schwarz, Tower Semiconductor, UMS, HRL and more.  Visit the Cadence IMS2022 event web page for details and schedules.

I look forward to seeing you there!

WHEN: IMS12022 takes place June 19-24, 2022.

WHERE: Colorado Convention Center, 700 14^th Street, Denver, CO. Cadence is in booth #5050.