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Inserting a blind and a buried via???

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Hi all,
          I am using a 8 layer board and I have to incorporate some BGA packages(Processor, DDRII). The issue is, i have to fan out the processor in the third layer and DDRII in the 5th layer supopose, do I have to use burried via or blind via?
          I don't know how to use them, can any one guide me through this.


Thanks and regards
Niraj


Originally posted in cdnusers.org by nforniraj
Parents
  • Whoviac

     Can you place a via on top of another pin pad? I have 2 seperate pin pad rows around the edge of my layout: one row is on the top layer and one row is on the bottom layer. The problem is that I have to make these top and bottom rows  present on the surface only, because if they become multilayer, they will overlap. Using a smaller via I was hoping to make internal layer connections to these top and bottom rows by placing a smaller via on each of the larger surface only pads. This way I can connect these top and bottom surface rows directly to internal layers without them overlapping. Can a mask be generated properly using this method?

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  • Whoviac

     Can you place a via on top of another pin pad? I have 2 seperate pin pad rows around the edge of my layout: one row is on the top layer and one row is on the bottom layer. The problem is that I have to make these top and bottom rows  present on the surface only, because if they become multilayer, they will overlap. Using a smaller via I was hoping to make internal layer connections to these top and bottom rows by placing a smaller via on each of the larger surface only pads. This way I can connect these top and bottom surface rows directly to internal layers without them overlapping. Can a mask be generated properly using this method?

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