Breakfast Bytes Blogs

Coming up on July 28 is CadenceCONNECT Aerospace and Defense Systems Day. Cadence experts will present on the most important issues facing teams in aerospace and defense (A&D). There is a common thread running through the presentations, namely how A&D should adopt the best practices of the commercial world. In my admittedly limited experience, people working in A&D find it hard to believe that in the commercial world design teams routinely have their chips work first time, and without requiring a schedule of five years to do it. In fact, people working in A&D have an example of this in their pockets (if they are not working in an area where personal communications equipment and cameras are banned). The big chip in a smartphone is called the application processor, and no matter what brand of phone, that chip was designed with the tightest of deadlines possible—if you don't have phones available in October to be given as gifts, then people will buy a different one.

Defense Acquisition University

As it happens, on July 22 (in just a few days), I am presenting a version of my Semiconductor and Systems 101 presentation at Defense Acquisition University. You can see last year's version of this in my post EDA101 Video. The presentation is the opening presentation of a four-week course, with the other presentations being given by Cadence's Frank Schirrmeister. To register for any or all of these, or to learn more details, click on the links below. Despite the name, you do not have to be in the military to attend.

• July 22 - Microelectronics Series: #1 - Semiconductor and Systems 101
• July 29 - Microelectronics Series: #2 - EDA and Computational Software Tools 101
• August 5 - Microelectronics Series: #3 - Digital Twinning
• August 12 - Microelectronics Series: #4 - Hardware/Software Co-Development and Verification

CadenceCONNECT Aerospace and Defence Systems Day

Once again, this is on July 28 and is a virtual event. It starts at 8:30am PDT (11:30am EDT). The speakers are (all from Cadence):

Keynote

• Heterogeneous Design and Analysis for RF/uWave, Tom Beckley, SVP & GM, R&D

RF & Microwave IC Design

• RF and Microwave IC Design Overview, Josh Moore, Sr. Solutions Architect
• Improving Design Throughput with PCBs with Critical RF Circuits, Shane Coffman, Principal Solutions Engineer
• Solutions for Silicon RFIC Design, Art Schaldenbrand, Sr. Principal Product Engineer  

RF & Microwave Module Design

• RF and Microwave Module Design Overview, Josh Moore, Sr. Solutions Architect
• Using Virtuoso RF to Simplify Integration of Heterogeneous Technologies, Claudia Roesch, Product Engineering Director
• Using Microwave Office Designs in Virtuoso Platform for RF Systems Analysis, Gus Dallman, Principal Solutions Engineer
• Introducing Clarity 3D Solver: a 10X Improvement over Existing Solutions, Lawrence Der, Senior Principal Applications Engineer
• Deploying Integrated Thermal Analysis on a III-V Design Within Microwave Office, Isaac Lee, Principal Applications Engineer

Advanced Multi-Chip(let) Packaging and 3D-IC

• Moving from System on a Chip to System in a Package, John Park, Product Management Group Director
• High-Performance 3D-IC Design, Brian Jackson, Product Management Director for Cross-Platform Solutions
• Exploring Digital System Architectures and Accelerating Implementation with High-Level Synthesis, Sean Dart, Sr. Group Director R&D 

Mixed-Signal Verification

• Mixed-Signal Verification, Tim Pylant, Solution Director
• Deploying Real Number Modeling to Rapidly Locate Mixed-Signal Bugs, Daniel Cross, Sr. Principal Solutions Engineer
• Metrics Analysis for Quantifiable Assurance, Adam Sherer, Account Technical Executive

Computation Fluid Dynamics (CFD)

• Pointwise - The Choice for CFD Meshing, Nick Wyman, Software Engineering Director
• Omnis - From Meshing to Solving to Optimization in One Single Environment, Yannick Baux, Product Engineering Director

Learn More

Full details are on the CadenceCONNECT Aerospace and Defense Systems Day page, which includes a link for registration. Or just click below.

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