A Year of Breakfasts 2021

This year's Breakfast Bytes annual is out. It is titled A Year of Breakfasts 2021: Systems, 3D Packaging, Cloud, RF, Memory, Deep Learning…and Eggs.

So how do you get one? If you attend CadenceLIVE Americas, and get enough points to get any of the giveaways, then you can get a free copy by ticking the box and asking for one. You can also buy a copy on Amazon for around $10 in your local currency. I expect that there will be ways to get a copy through other CadenceLIVE events, DAC, and perhaps other shows that we attend during the year. For now, it is to attend CadenceLIVE Americas and get a free copy, or buy a copy on Amazon.

The chapters are:

• Introduction
• Chapter 1: Markets
  • The Five Waves: AI, 5G, Cars, Clouds, IoT
• Chapter 2: Mobile and 5G
  • 1G Mobile: AMPS, TOPS, C-450, Radiocom 2000, and All Those Japanese Ones
  • 2G
  • 3G and 4G: The Internet Arrives
  • 5G: Connecting All the Things
• Chapter 3: Hyperscale Datacenters
  • Getting to Hyperscale Data Centers
• Chapter 4: System Analysis
  • System Analysis: Computational Software at Scale
  • Bringing Clarity of Signal to High-Performance Connector Design
  • Thermal Analysis of Protium X1
• Chapter 5: PCB and Packaging
  • John Park's Webinar on Chiplets
  • Rigid-Flex
  • InspectAR: Augmented Reality in Newfoundland
  • Avoiding PCB Respins with Better Computational Software
• Chapter 6: Verification
  • Signoff in the Cloud
  • vManager: One Manager to Rule Them All
  • Computational Logistics
  • Xcelium ML: Black-Belt Verification Engineer in a Tool
  • System VIP: Logistics for Cache-Coherent Multiprocessor Systems
  • Jasper User Group: The State of Formal in 2020
• Chapter 7: Implementation
  • IEEE 1838: Taking Test into the Third Dimension
  • Computational Digital Software
  • Use Your Imagination to Get Smaller, Faster Chips
  • Innovus Mixed Placer
  • Optimized Digital Design, Implementation, and Signoff on TSMC N3
  • Pegasus Certified Down to 3nm at TSMC
  • Taking Arm Neoverse into 3D with Digital Full Flow
  • Innovus for Digital 3D-IC Designs
• Chapter 8: IP
  • HiFi DSPs - Not Just for Music Anymore
  • Custom Instructions in Tensilica: Wearing a TIE Makes You Smarter
  • What to Do About IP Developed Before ISO 26262?
  • TSMC OIP: Rent's Rule and Fast SerDes IP
• Chapter 9: RF
  • Designing Radios and Radar: AWR
  • Designing Radios: Integrand
  • Complete RF Solution: Think Outside the Chip
• Chapter 10: Other
  • A History of Neural Networks
  • Japanese Arm-Powered Supercomputer Takes the TOP500 Crown
  • DAC 2020: Chips in 2030
• Chapter 11: Predictions
  • 2021 Predictions

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