CES 2023 Preview: Come and See Us in the Venetian

It's nearly a New Year, and as usual, CES (what used to be called the Consumer Electronics Show,  but now just goes by its initials) will take place Thursday, January 5  - 8. Cadence will be there January 5 - 7. Hours are 10:00am to 6:00pm on Thursday, and 9:00am to 6:00pm on the other two days.

We are in a new location in the Venetian. Our booth will be on level 2, in Titian 2301A and 2201B (despite having two booth numbers, our space will actually be configured as a single booth). Obviously, Cadence has an extensive portfolio of EDA tools for ICs, packages, and PCBs. But nobody comes to CES to find out about those, so as always, our focus is entirely on Tensilica consumer and automotive applications.

CES always has a tagline, and this year it is "BE IN IT". We will indeed be in it. I expect that there will continue to be a lot of emphasis on the Metaverse. I don't think anyone knows to what extent the Metaverse will be the next big thing, but for sure, if it is, nobody wants to miss it.

If you've never been to the Venetian, you won't be surprised that it has a re-creation of the Grand Canal in Venice, complete with gondolas. What makes it so "Vegas" is that the canal is on the second floor! If you plan to visit the real Venice in Italy, then I recommend going in the fall or winter. The misty atmosphere in the city makes it more of an experience, plus there are a lot fewer tourists.

Tensilica HiFi DSPs

In the audio space, Cadence's Tensilica HiFi DSP product line is the "best seller", with well over 100 licensees shipping 2B cores per year. The graph below shows the product range, from the newest HiFi 1 DSP, designed for always-on applications (see my post Always Listening, HiFi 1 DSP), up to the HiFi 5 DSP (see my post "Alexa, What Is HiFi 5?") focused on powerful audio processing.

Come and see demos of Tensilica HiFi DSPs by Cadence customers:

• DSP Concepts/Sensory – AudioWeaver Automotive Audio Demo (Samsung Exynos SoC with HiFi 5 DSP)
• Alango – TWS and Headphone Voice and Hearing Enhancement
• Mimi Hearing Wellbeing – Hearing Enhancement
• Fluent.AI – AI Voice Activation and Recognition

Tensilica Vision and AI

A big application combining vision and AI is called SLAM, which stands for simultaneous localization and mapping (see my post It's a SLAM Dunk Programming the Vision Q7 DSP for more about this). Here's the portfolio:

Come and see demos of vision and AI applications:

• Xvisio SLAM on MediaTek platform
• Vision Q7 DSP based SLAM on Protium FPGA
• Vision P1 Ultra Low Power Always-on
• People detection on MediaTek Genio 500
• ADAS and parking assistance on Black Sesame Technologies HS-1000
• Image super resolution
• Concurrent multi-modal ML workload execution

Radar, Lidar, Communication, 5G

There is a special line of processors targeted at the demanding computational needs of applications like radar or 5G modems. For my most recent post on the topic, see Tensilica for Automotive Radar. This covers a presentation by Cadence at the recent Linley Fall Processor Conference.

At CES, you will be able to see:

• NXP Advanced 4D imaging radar platform for ADAS/autonomy

Consumer Products

It's the consumer electronics show, and so we have lots of consumer electronics products on display that contain Tensilica DSPs. I'm not going to list them all here, because, in some cases, we are only allowed to discuss them under NDA. But there are smartphones, smart speakers, earbuds, augmented reality, hi-fi speakers, and more.

Book a Meeting

The Cadence page with details of CES includes a button to book a meeting with us.

 

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