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As usual in August, it is HOT CHIPS. I always find this one of the most interesting conferences of the year. It gives a lot of insight into the specific products being presented, but also a feel for what technologies are being used for the most advanced designs. For example, the move towards chiplets and advanced packaging as the way of the future was one of the things that was hard to miss at HOT CHIPS a couple of years ago. The conference will be completely virtual again this year, as it was last year. As usual, the first day is a tutorial day, and then two days of presentations about the chips. This year, there is no separate fee for tutorials or for single days, there is simply one fee to attend and then you can attend anything. It is all available for replay afterward, too. I will attend and report on some of what gets presented, as I have done for several years.
All times are Pacific Daylight Time.
If you had to name two big trends in semiconductor systems, then you might well pick machine learning and advanced packaging. Those are the subjects of the two tutorials on August 22 (yes, it's a Sunday, you have to suffer for knowledge).
There are also a couple of dozen "posters". I'm not quite sure how that works in a virtual-only conference. There are several posters on photonics and several on AI.
All the details are on the HOT CHIPS website, including a link for registration. Early (cheaper) registration ends on August 6.
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