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The big event for semiconductor process news is IEDM, the International Electron Devices Meeting. This year it will take place from December 11 to 15 at its usual location, the San Francisco Hilton Hotel as an in-person event. Then on-demand access to the material will be available starting December 17. This will be the 67th IEDM, which explains its slightly odd name—when IEDM started, electronics was about vacuum tubes and transistors were an afterthought banished to a single session on the final afternoon.
This year’s theme is “Devices for a New Era of Electronics: From 2D Materials to 3D Architectures,” chosen to reflect two powerful industry trends: the use of so-called 2D materials (having thicknesses measured in atoms) in order to further miniaturize transistors, and the use of a variety of 3D architectures to incorporate more features and performance from the device to the chip to the package.
This year the IEEE IEDM conference features a rich collection of presentations on topics that are on everyone’s minds. Among them are the advent of 2D materials, the growing number and diversity of 3D architectural concepts, the rise of system/technology co-optimization, and the possible end of Moore’s Law. Breakthroughs in these and other areas will be presented and discussed, and ultimately will help the industry and society as a whole move forward.
As usual, the conference starts on Saturday afternoon with tutorials, then on Sunday there will be short courses, a plenary session on Monday, and then about a dozen parallel tracks of technical papers for the rest of the week. Everything will be available on demand once the conference is over starting on December 17.
The tutorials are on the afternoon of Saturday, December 11.
2:45pm to 4:15pm:
4:30pm to 6:00pm:
The short courses run in parallel on Sunday December 12 from 9:00am to 5:30pm. Historically, one of the courses has been on logic processes and one on memory, but this year one course covers scaling and integration, and the other covers low-power AI at the edge.
Short Course 1: Future Scaling and Integration Technology (organizer: Dechao Guo, IBM Research):
Short Course 2: Emerging Technologies for Low-Power Edge Computing (organizers: Huaqiang Wu, Tsinghua University and John Paul Strachan, Forschungszentrum Jülich):
See the IEDM website.
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