Cadence® system design and verification solutions, integrated under our System Development Suite, provide the simulation, acceleration, emulation, and management capabilities.
Verification Suite Related Products A-Z
Cadence® digital design and signoff solutions provide a fast path to design closure and better predictability, helping you meet your power, performance, and area (PPA) targets.
Full-Flow Digital Solution Related Products A-Z
Cadence® custom, analog, and RF design solutions can help you save time by automating many routine tasks, from block-level and mixed-signal simulation to routing and library characterization.
Overview Related Products A-Z
Driving efficiency and accuracy in advanced packaging, system planning, and multi-fabric interoperability, Cadence® package implementation products deliver the automation and accuracy.
Cadence® PCB design solutions enable shorter, more predictable design cycles with greater integration of component design and system-level simulation for a constraint-driven flow.
An open IP platform for you to customize your app-driven SoC design.
Comprehensive solutions and methodologies.
Helping you meet your broader business goals.
A global customer support infrastructure with around-the-clock help.
24/7 Support - Cadence Online Support
Locate the latest software updates, service request, technical documentation, solutions and more in your personalized environment.
Cadence offers various software services for download. This page describes our offerings, including the Allegro FREE Physical Viewer.
The Cadence Academic Network helps build strong relationships between academia and industry, and promotes the proliferation of leading-edge technologies and methodologies at universities renowned for their engineering and design excellence.
Participate in CDNLive
A huge knowledge exchange platform for academia to network with industry. We are looking for academic speakers to talk about their research to the industry attendees at the Academic Track at CDNLive EMEA and Silicon Valley.
Come & Meet Us @ Events
A huge knowledge exchange platform for academia. We are looking for academic speakers to talk about their research to industry attendees.
Americas University Software Program
Join the 250+ qualified Americas member universities who have already incorporated Cadence EDA software into their classrooms and academic research projects.
EMEA University Software Program
In EMEA, Cadence works with EUROPRACTICE to ensure cost-effective availability of our extensive electronic design automation (EDA) tools for non-commercial activities.
Apply Now For Jobs
If you are a recent college graduate or a student looking for internship. Visit our exclusive job search page for interns and recent college graduate jobs.
Cadence is a Great Place to do great work
Learn more about our internship program and visit our careers page to do meaningful work and make a great impact.
Get the most out of your investment in Cadence technologies through a wide range of training offerings.
Overview All Courses Asia Pacific EMEANorth America
Instructor-led training [ILT] are live classes that are offered in our state-of-the-art classrooms at our worldwide training centers, at your site, or as a Virtual classroom.
Online Training is delivered over the web to let you proceed at your own pace, anytime and anywhere.
Exchange ideas, news, technical information, and best practices.
The community is open to everyone, and to provide the most value, we require participants to follow our Community Guidelines that facilitate a quality exchange of ideas and information.
It's not all about the technlogy. Here we exchange ideas on the Cadence Academic Network and other subjects of general interest.
Cadence is a leading provider of system design tools, software, IP, and services.
Get email delivery of the Cadence blog featured here
In this introductory Part I of V of this blog I will discuss the advanced node design challenges impacting CIC design convergence and the solutions to achieve expedited physical implementation convergence.
As designers move to 65nm technologies and below, the convergence of performance-driven design constraints and yield-driven manufacturing constraints intensifies the demand for new approaches for integrated circuit (IC) physical design (Figure 1).
At these geometries, more complex manufacturing effects dramatically impact the way engineers need to tune physical designs for optimal performance and yield. Besides addressing familiar speed and capacity concerns, advanced physical design requires an architectural approach that emphasizes quality of results, more effective convergence across a broader array of constraints, and significantly greater control by designers of the physical design process itself.
Faster routing of larger designs is not enough, and design convergence means much more than area, timing and power. Instead, designers need the ability to analyze routing more effectively, and incrementally improve both performance and yield with each physical design iteration.
As the electronics industry continues to drive toward more advanced manufacturing technologies, semiconductor companies face shrinking product lifecycles and rising demand for greater functionality. For engineers, each advance in design and manufacturing capabilities brings greater challenges in every phase of development, yet dictates a greater need to reach closure on a growing list of divergent constraints arising from each stage in the development cycle.
As engineering teams move designs from high-level and detailed logic design to floorplanning and routing in physical design, they must work collaboratively to ensure that physical design maintains tight objectives for design performance, functionality and manufacturability. Accordingly, physical design and verification needs to work smoothly in the design flow, efficiently providing detailed results needed to ensure high quality results within tightening product schedules.
Yet, as designs move to deep nanometer technologies at 65nm and below, designers find that electronic design automation (EDA) tools developed even for 90nm designs are unable to address the further challenges associated with these advanced technologies. Inevitably, the lack of precise analysis of device performance at these new geometries forces design teams to make tradeoffs and concessions to ensure manufacturability.
In Part II thru V of this blog I will discuss the sub-topics of Growing Complexity, Successive Refinement, Constraint-driven Physical Design, and the Fundamental Change required for advanced node CIC design convergence.
I appreciate you using this forum to post informative information. When I go to a web site it is to get helpful information or to read something of value. This is the kind of blog that is worth reading. Thanks again