AI-Driven Design and the McLaren Artura Supercar

The Global Semiconductor Alliance’s (GSA) 30th Anniversary Awards Dinner spotlighted the innovations and leaders propelling the semiconductor industry into the future. Held in grand fashion, the evening celebrated three decades of progress in an industry that continues to reshape our world. Cadence was proud to sponsor the awards dinner reception, bringing together visionaries and executives for a night of inspiration, achievement, and technology-driven excitement.

The Reception

The event was nothing short of spectacular. A McLaren F1 car and the McLaren Artura Supercar made dynamic appearances, bridging the world of cutting-edge automotive design and the engineering breakthroughs of the semiconductor industry. The synergy was clear—both fields thrive on pushing boundaries, innovating at speed, and delivering excellence.

Adding to the evening’s glamour was the legendary Jay Leno, who took the stage as the host. Known for his wit and love of all things automotive, Leno kept the audience entertained and engaged while celebrating the honorees of the night.

McLaren Formula 1 Racecar and McLaren Artura Supercar

Making an appearance at the reception was a McLaren Formula 1 racecar, along with a McLaren Artura supercar. These beautiful cars lit up the room and delighted the semiconductor leadership community.

In 2022, Cadence was named an Official Technology Partner of the McLaren Formula 1 Team. Through the multi-year partnership, McLaren has access to Cadence Fidelity CFD Software, a cutting-edge solution that provides innovative aerodynamic prediction tools that are setting new standards in racing. As a result, we recently published a white paper on McLaren Formula 1 Car Aerodynamics Simulation with Cadence Fidelity CFD Software.

"Efficiency and pace are probably two of the most important words in Formula 1, both of which we are going to benefit from in our relationship [with Cadence]."

Zak Brown, CEO, McLaren Racing

GSA Awards - Celebrating Excellence in Leadership

The highlight of the dinner was the recognition of some of the most influential leaders and innovators in the semiconductor industry. A heartfelt congratulations to this year’s award recipients!

Dr. Morris Chang Exemplary Leadership Award

Hock Tan, President and CEO of Broadcom

Women of Influence

An Mei Chen, Qualcomm Technologies

Start-Up to Watch

Celestial AI

Most Respected Private Semiconductor Company

SambaNova Systems

Most Respected Public Semiconductor Company achieving >$5B sales

NVIDIA

Most Respected Public Semiconductor Company achieving $1B-$5B sales

Qorvo

Most Respected Public Semiconductor Company achieving $500M-$1B sales

Lattice Semiconductor

Most Respected Public Semiconductor Company achieving $100M-$500M sales

Credo

Best Financially Managed Semiconductor Company

NVIDIA

Analyst Favorite Semiconductor Company

NVIDIA

Outstanding Asia-Pacific Semiconductor Company

MediaTek, Inc

Outstanding EMEA Semiconductor Company

NXP Semiconductor

Their work illustrates the creativity, resilience, and ingenuity that continue to define this industry after 30 years of progress.

AI-Driven Design from Transistors to the Track

Amid the celebrations, the theme of technological breakthroughs took center stage. AI innovation stole the show, once again proving its importance as a transformative force in semiconductor design. Alongside it, 3D-IC technology emerged as the “comet,” propelling the industry forward at unprecedented speed. Together, these forces are reshaping the way semiconductors are designed, built, and deployed.

A recent groundbreaking achievement is the first ADAS System chiplet tapeout for the automotive industry, marking a step forward in the quest for smarter, safer vehicles. Chiplets and 3D-IC are enabling more collaboration and faster time-to-market for innovative new functionality. From solving memory bottlenecks to enabling massive scalability, 3D-IC is driving the AI buildout by breaking through the limitations of traditional chip designs.

AI-driven design solutions are proving to be game changers for the entire semiconductor design community. By automating complex tasks and enabling better decision-making, these tools are helping engineers produce more optimized designs in less time, overcoming complex AI chip design issues. This productivity is also helping address the challenges of a growing talent gap.

Reflecting on these Past 30 Years and Looking Ahead

The GSA’s 30th Anniversary Awards Dinner was not just a celebration of the past but a vision for the future. With AI and 3D-IC technology at the forefront, the semiconductor industry is poised to revolutionize everything from automotive innovation to data center efficiency, setting new standards for what’s possible.

Cadence remains committed to empowering this future, enabling the industry’s pioneers to deliver cutting-edge solutions that reshape the way we live, work, and connect.

Here’s to the next 30 years of innovation, collaboration, and technology that changes the world.

Learn More

• First System Chiplet Tapeout
• Chiplet outlook 2025
• Cadence AI-Driven Semiconductor Design Solution