Cadence Signs EuroCDP Agreement to Support European Chip Innovation

Agreement with the European Chips Joint Undertaking extends access to Cadence EDA and Systems technologies and Managed Cloud Service for eligible European startups and SMEs.

Cadence has signed an agreement with the European Chips Joint Undertaking (Chips JU) to make its electronic design automation (EDA) and Systems tools, along with its Managed Cloud Service, available to eligible semiconductor startups and small and medium-sized enterprises (SMEs) through the European Chips Design Platform (EuroCDP).

The agreement covers both EuroCDP Level 1 and Level 2, giving participating companies access to Cadence technologies through a program designed to address one of the challenges facing emerging semiconductor businesses: the cost of accessing advanced chip design tools.

Reducing Barriers to Advanced Chip Design

Developing a semiconductor product requires specialized tools across multiple stages, from architecture and RTL design to functional verification, physical implementation, and signoff. Each stage demands advanced software and engineering expertise to address performance, power, area, and reliability requirements before a design is ready for manufacturing.

For startups and SMEs, investing in these capabilities can place considerable demands on limited resources, particularly when teams are simultaneously developing silicon, validating products, and raising capital. EuroCDP provides a funding framework intended to make access to these technologies more affordable for eligible companies.

By lowering this barrier, the program is intended to help more European innovators access the design technologies needed to develop competitive chips for AI, high-performance computing (HPC), automotive, industrial, and connectivity applications.

What Cadence Brings to EuroCDP

Cadence's EDA portfolio spans digital and custom/analog IC design, verification, physical implementation, and signoff. Its Systems portfolio supports design and analysis across broader electronic systems.

Together, these technologies address different aspects of semiconductor and system development, from exploring design architectures and verifying functionality to evaluating implementation trade-offs and preparing designs for manufacturing.

For startups working on chips for AI, high-performance computing (HPC), automotive, industrial, and connectivity applications, access to these capabilities can help establish the design infrastructure needed to develop and validate their products.

The Level 1 and 2 agreements currently cover EDA and Systems tools and Managed Cloud Service. Cadence also plans additional agreements covering IP and Emulation technologies, which would extend the range of Cadence capabilities available through the initiative.

A Broader Push to Strengthen Europe's Chip Design Capabilities

The European Chips Act seeks to strengthen Europe's position in the global semiconductor industry by supporting research, design, manufacturing, and the development of semiconductor talent. Initiatives such as EuroCDP focus on an important part of that ambition: giving emerging companies access to the resources needed to develop semiconductor products.

The platform brings together technology providers and the European network of Chip Competence Centres to help eligible companies navigate access to design capabilities and funding opportunities.

Cadence's participation adds its EDA and Systems technologies, along with Cadence Cloud Infrastructure to the platform's available resources, giving European semiconductor startups and SMEs another option as they build and advance their designs.

"Access to advanced design technologies is essential for companies developing new semiconductor products. Through our agreements with Chips JU, Cadence is making its EDA and Systems technologies and Managed Cloud Service available to eligible startups and SMEs through EuroCDP. We are pleased to contribute to an initiative that supports Europe's semiconductor innovation ambitions." – Joe Cole, Corporate VP, Sales at Cadence

How to Apply

Companies interested in participating in EuroCDP should first contact the EuroCDP team to discuss their requirements and explore the available opportunities.

For companies seeking funding through the program, the application process involves the following steps:

1. Check eligibility: Review the eligibility criteria for your company and project, including the applicable funding level.
2. Identify technology requirements: Select the EDA tools, IP, and design enablement technology (DET) services required for your project, and obtain quotations from the relevant suppliers. EDA tools and IP must be covered by EuroCDP vendor agreements.
3. Prepare your proposal: Develop your project proposal and complete the required budget and financing workbook.
4. Submit your application: Apply through the EuroCDP Grant application page before the relevant deadline and retain your submission receipt.

 To learn more about Cadence's semiconductor design and engineering technologies, visit https://www.cadence.com.