See AuraStack AI Super Agent in Action!

Modern AI systems are pushing electronic design into a new phase of complexity. High-bandwidth memory, advanced packaging, dense power delivery networks, and high-speed interconnects require engineers to optimize electrical, thermal, mechanical, and manufacturing constraints together rather than in isolation.

The AuraStack AI Super Agent, built on Cadence Allegro AI Studio, extends Cadence's Intelligent System Design strategy into PCB and advanced packaging design. It connects design intent, implementation, multiphysics analysis, and optimization into a single continuous workflow.

Connected Design Workflow

The AuraStack AI Super Agent helps engineering teams keep power integrity, thermal behavior, placement, routing, and signal integrity analysis connected throughout the design cycle.

This unified workflow enables earlier tradeoff decisions and reduces the late-stage redesign cycles that often occur when analysis and implementation are disconnected.

System-in-Package Intelligence

As designs scale into advanced packaging, coordination across electrical, thermal, and physical domains becomes increasingly important. Multi-die architectures, HBM integration, and dense interconnect structures require package planning, signal integrity, and power delivery to remain tightly connected.

The AuraStack AI Super Agent extends its intelligence layer to support multi-die floorplanning and alignment, HBM integration and RDL planning, and high-speed interconnect and signal integrity optimization. This provides system-level visibility across PCB, package, and silicon, helping engineering teams improve convergence for AI accelerators, networking platforms, and other high-performance computing systems.

NVIDIA Collaboration: Accelerated Engineering Ecosystem

The AuraStack AI Super Agent operates within a broader Cadence + NVIDIA accelerated engineering ecosystem designed to support increasingly complex AI and high-performance computing systems.

By combining Sigrity X Platform, Celsius Thermal Solver, Clarity 3D Solver, and NVIDIA Blackwell accelerated computing, the AuraStack AI Super Agent enables large-scale multiphysics simulation with faster iteration cycles, higher-fidelity analysis, and real-time design feedback.

This integration helps engineering teams explore more design alternatives, validate system behavior earlier, and scale analysis across demanding AI and HPC workloads.

Ready to Accelerate Your Next Electronic System Design?

The AuraStack AI Super Agent helps engineering teams keep signal integrity, power integrity, thermal behavior, electromagnetic effects, and mechanical reliability connected throughout the PCB and advanced packaging design process. By bringing these domains together in a continuous, analysis-driven workflow, it enables earlier visibility into cross-domain interactions, supports faster design iteration, and helps reduce the costly late-stage surprises that often lead to respins.

For AI accelerators, HBM-based systems, networking platforms, and other high-performance electronic systems, this integrated multiphysics approach provides a more practical path to achieving predictable system-level convergence from the start.

Explore the AuraStack AI Super Agent and its AI-native approach to PCB and advanced packaging design, read the press release, and discover how Cadence is extending agentic AI across the complete electronic system design flow.