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According to Gordon E. Moore, “The future of integrated electronics is the future of electronics itself.” This means that the advantages of integration will bring rapid change in electronics by integrating more transistors on a chip. Moore's law states that the number of transistors on a microchip doubles roughly every two years, leading to exponential growth in power, performance, and area (PPA), ultimately resulting in electronic devices reducing in size. However, what is the future of integrated circuits (ICs)? How do we design ICs with better PPA in the future? In this blog post, we will learn about the past, present, and future of ICs.
How humans think, live, and work evolves with the passage of time. We strive to enhance our abilities, resulting in a higher quality of life. Numerous factors contribute to these changes, such as technological progress, cultural transformations, economic growth, and environmental issues. However, rapid change happens due to technology integration, mainly through advancements in ICs.
Today, we design chips that follow Moore's law; however, as we progress to smaller technology nodes (e.g., 2nm or 1nm), transistors will continue to shrink, making it increasingly challenging to maintain the pace of growth. Right now, we integrate more transistors on a chip in two dimensions. The future is 3D Heterogeneous Integration or 3D-IC, which involves stacking multiple dies vertically to create a single integrated circuit; this can lead to significant advancements in the field of integrated circuits.
Why 3D-IC is Required Now?
Cadence offers the Integrity 3D-IC Platform, a new platform that will help design the complete 3D-IC chip with a recommended flow. To learn more about 3D-IC technology and the Integrity 3D-IC Platform, I encourage you to see the following training byte videos for a complete overview.
After watching the following training bytes, you will know:
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