From Defects to Diagnostics: How DFT Transforms Chip Manufacturing

In today’s semiconductor industry, the complexity of integrated circuits (ICs) is skyrocketing. Ensuring these chips work flawlessly isn’t just a technical challenge, it’s a business necessity. This is where Design for Test (DFT) comes in, acting as the backbone of reliable, cost-effective chip manufacturing.

What Is DFT?

DFT refers to a set of design techniques that make it easier to test manufactured chips for defects and faults. By adding testability features during the design phase, engineers can efficiently verify, debug, and validate chips before they reach customers.

DFT is not just about catching errors—it’s about building quality from the ground up. Its main objectives include:

• Detecting Defects Early: Identify manufacturing defects (opens, shorts, improper vias) before chips are shipped.
• Ensuring Product Quality: Minimize “test escapes” (defective chips passing tests) and maximize yield.
• Supporting Diagnostics: Enable rapid failure analysis and process improvement.
• Reducing Test Costs: Streamline testing to save time and resources.

Chip testing is vital for profitability—catching faults early saves money, while undetected defects found later can lead to huge costs or even bankruptcy.

Why Take the Design for Test Fundamentals Training (25.1)?

Cadence’s “Design for Test Fundamentals” (v25.1) training is tailored for engineers and students eager to master DFT concepts and tools. The course blends theory with hands-on labs, using industry-standard software (like Genus Synthesis Solution) to teach real-world DFT flows.

Highlights of the 25.1 Release

• This version introduces a dedicated lab and accompanying database, which were not available in previous releases.
• Learners now get hands-on experience with real tools and flows, making the course much more practical and interactive.
• The lab walks users through running the synthesis flow with Design for Test (DFT) for a counter design using Genus Synthesis Solution in Stylus Common UI mode.
• Step-by-step guidance is provided for scan insertion, DFT setup, and ATPG flow, making complex concepts accessible.

Learning Objectives

In this course, you will be able to,

• List out the reasons for testing and its different aspects
• Describe how to perform testing
• Compare defects and faults
• Identify commonly used fault models
• Demonstrate the generation of test patterns for combinational, sequential, and scanned circuits
• Identify basic DFT design rules
• Illustrate special tests for memory, cores, self-test, compression, I/Os, etc.
• List out test escapes and their effect on test volume and product quality
• Identify the basic diagnostic capabilities

Explore Video Library

Short videos make learning more efficient, engaging, and accessible, especially for technical topics or tools training. Here are some short videos you can explore:

• What is Test Compaction?
• What is Manufacturing Test?
• How to Diagnose the Failing Chips?
• What is Scan Testing?
• How to Generate Single Fault Test in Combinational Circuits?
• What are Manufacturing Defects?
• What is Functional and Structural Testing?

Badge Exam

Upon successful completion of the course and its assessment, participants receive a Cadence Certified Digital Badge. This badge is validated by Credly and can be shared on professional platforms such as LinkedIn, email signatures, and resumes—enhancing your visibility and credibility in the industry.

Happy learning!