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Even with the DRAM capacity going up with each generation of DRAM, the demand for memory densities by variety of applications, is growing at even faster rate. To support these high memory densities and bus width requirements (that are typically more than what a single DRAM can support) almost all the new generation of memory sub systems and SOCs have multiple DRAM Dies combined to effectively create higher density memories with more bus width than individual DRAM. There are many ways in which multiple individual DRAMs can be combined to create higher effective density DRAMs. One of the most common ways to do that is to create DIMMs with DRAMs organized in a defined structure that had multiple Ranks with each Rank containing multiple component DRAMs. Other options can include using Die stacking with multiple DRAM Dies on top of each other to create 3DS SDRAM (like DDR4/DDR5 3DS) and even those can be used as DRAM components of DIMMs.
With a Multi DRAM system there are several things that system designer/Host has to consider for system to be able to work as expected in addition to the requirement that apply to single DRAM. These are vital for memory sub system to perform desired function.
Here is the list of some of the most important of consideration for multi DRAM system: -
As the memory sub systems evolves to meet growing memory demands, memory standards are also evolving to define requirements and expectation of multi DRAM environment. JEDEC DDR5+ and LPDDR5 memory specification are very good examples of this tread and have extensive requirement and usage consideration included in the standard.
Cadence MMAV VIPs for DDR5 SDRAM, DDR5 DIMM, LPDDR5/LPDDR5X and LPDDR5 Multi Die Package are compressive VIP solutions and supports all of the above listed features for multi DRAM system.
More information on Cadence DDR5 and LPDDR5 VIP is available at Cadence VIP Memory Models Website.