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The JEDEC UFS (Universal Flash Storage) started in 2011 with the v1.0 first specification version, supporting a bandwidth of 300 MB/s per lane. Since then JEDEC has been continuously releasing new UFS specification versions on top of the MIPI UniPro® and MIPI MPHY® evolving specs. UFS is now evolving to a new version of 3.0, reaching a total bandwidth of 2.4 GB/s. It seems that UFS keeps on slowly winning over eMMC in the mobile market, replacing it in the high end mobile and slowly taking over in the medium/low end as well.
But UFS is not stopping there, after taking over the mobile market it is now entering the automotive market and ready to conquer its next target. New cars are requiring more sophisticated systems with automotive information and entertainment systems and ADAS with more storage requirements for automotive applications. UFS supports their high performance and density needs providing a suitable solution.
In last September, Samsung Electronics introduced the industry’s first embedded Universal Flash Storage (eUFS) solution for use in next-generation automotive applications. Since then, Toshiba and Micron joined the party releasing UFS devices based on the UFS v2.1 standard.
The UFS 3.0 specification is planned to be released in the first months of 2018. With the availability of the Cadence Memory Model for UFS 3.0, early adopters can begin working with the new specification immediately, ensuring compliance with the standard and achieving the fastest path to IP and SoC verification closure. The UFS 3.0 Memory Model provides a full-stack solution, including support for MIPI Unified Protocol (UniPro) 1.8 and MIPI M-PHY 4.1 VIPs, with comprehensive coverage model and test suite. More details are available in MIPI verification IP portfolio.