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Community Blogs SoC and IP > Mobile World Congress: Two New Audio IP Announcements
Brian Fuller
Brian Fuller

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Tensilica
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Mobile World Congress: Two New Audio IP Announcements

16 Mar 2015 • Less than one minute read

BARCELONA, Spain—Mobile World Congress is not surprisingly focused on mobile devices, applications, and services. And the Cadence Tensilica team, which has been attending this event for a decade, generally has something up its sleeves when the booth opens for business each year.

This time was no exception. The company announced that DTS’s Headphone:X immersive sound technology has been optimized for the Cadence Tensilica HiFi Audio/Voice DSPs and, separately, that Waves MaxxVoice technology has been ported to and optimized for HiFi.

The news has significance consequences for mobile systems designers. To get a sense for just how significant, I chatted with Larry Przywara, Product Line Group Director Audio/Voice IP, Tensilica Products, at the booth:

Brian Fuller

Related stories:

—Cadence at CES 2015: Enabling Surreal Surround Sound Audio

—Whiteboard Wednesdays: Implementing Always-On Audio


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