3DGS Is Making Electrical Circuits in Glass

3D Glass Solutions Inc. (3DGS) is a leading manufacturer of electrical circuits in glass. Their technology overcomes the challenges of conventional approaches to device design and offers higher performance for radio frequency (RF) microwave and millimeter-wave (mmWave) applications. As technology continues to grow, 3DGS is enabling high-frequency, cost-effective performance that surpasses traditional 2D passive designs. And for that, they’re using Cadence tools for all their designs. 

3DGS’s process starts with photosensitive glass-ceramic wafers. The wafers are then masked, exposed to UV light, thermally processed, chemically etched, metalized, and plated. Because of the photosensitive glass, they can fit 40-micron vias in a 300-micron wafer. Whether it’s a single via or 50,000 of them on a wafer, it takes the same amount of time and cost, so their process is extremely scalable.

For the simulation software, 3DGS uses Cadence AWR Software, which provides them with the framework and flexibility they need to reach a large customer base. Cadence OnCloud, in particular, has been a handy tool for them and has helped them quickly get designs out without spending extra resources for a software kit in-house.

“Designed with Cadence” is a series of videos that showcases creative products and technologies that are accelerating industry innovation using Cadence tools and solutions. Learn more about how 3DGS empowers high-performance electronics with Cadence.

For more Designed with Cadence videos, check out the Cadence website and YouTube channel.