IC Packagers: Training Insights: What's New in the Allegro Package Designer Plus Course

The Allegro Package Designer Plus course provides all the essential training required to start working with Allegro® Package Designer Plus. The course covers all the design tasks, including importing IC data, BGA generation and connectivity generation, constraints setup, placement, routing, post-processing, and Gerber generation. We upgrade this course regularly to stay updated with the latest changes in the product.

Some of the newly added topics in the existing training modules that might interest you are discussed here:

Creating a BGA component with the BGA Generator

The BGA component is the interface from an IC Package design to the next level carrier in the system, which is usually the printed circuit board.

In Module 3 of the course, you learn how to use the BGA Generator to create a 421-pin BGA component and then use the Symbol Edit application mode in APD+ to modify the BGA.

Importing DIE Information into APD+

Die information can be imported into the APD+ environment in many ways including a Die Generator Text-in Wizard, or by importing GDSII data and converting it into a Die symbol.

In Module 4, first, you learn to create a flip-chip die by importing information from a text file, and then create a wire bond die by importing information from a GDSII file and converting the data into a Die symbol.

Assigning Die to BGA Pins

One of the main tasks in IC Package design is Die to BGA pinout assignments. APD+ has many features that quickly and automatically optimize the Die to BGA pinout assignments in a package design.

In Module 5, you will learn how to assign die pins to BGA pins using the Auto Assign Net command by specifying the shortest Manhattan distance and the minimum number of ratsnest crossings. You will also learn how to assign pins manually for the most critical or pre-defined nets.

Checking 3D Wire Bond

Wire bonds are the electrical connections from the wire bond die to the surface of the IC Package substrate. Visualizing these elements in three dimensions is critical to ensure the connection between the die and substrate.

In Module 7, you define 3D wire bond profiles and add wire bonds from your die pins to bond fingers on the surface of the IC Package substrate. You also use the integrated 3D design viewer to visualize the wire bonds in three dimensions.

To learn in detail about this course, enroll in the course Allegro Package Designer Plus v22.1 (Online) on the Cadence Support portal.

Click the training byte link now or visit Cadence Support and search for this training byte under Video Library.

If you find the post useful and want to delve deeper into training details, enroll in the following online training course for lab instructions and a downloadable design:

 Allegro Package Designer Plus v22.1 (Online) You can become Cadence Certified once you complete the course.

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