• Skip to main content
  • Skip to search
  • Skip to footer
Cadence Home
  • This search text may be transcribed, used, stored, or accessed by our third-party service providers per our Cookie Policy and Privacy Policy.

  1. Blogs
  2. System, PCB, & Package Design
  3. BGA Ball Map Creation
TeamAllegro
TeamAllegro

Community Member

Blog Activity
Options
  • Subscribe by email
  • More
  • Cancel
CDNS - RequestDemo

Try Cadence Software for your next design!

Free Trials
Co-Design
IC package design
I/O planning
BGA ball map

BGA Ball Map Creation

6 Jul 2015 • 1 minute read

Are you responsible for the creation and management of a BGA ball map or a die bump map of a packaged chip design? How much time do you spend creating these maps? How do these maps drive physical implementation in your design? It’s common for most companies to use spreadsheets to create the ball map or die bump map of a chip, and if you do, you know how tedious, time consuming, and error prone a process it is. On top of that, it does not even provide a WYSIWYG representation of the pin map!

Well, the good news is that there is an alternative (watch the YouTube video below). The video shows Cadence OrbitIO interconnect designer creating a BGA ball map in just a couple of minutes that feeds directly into an IC package design.

Creating a ball map in OrbitIO is quick and easy, and it even exports a spreadsheet view for reporting and design review.

I have just introduced one of several ball map creation flows available with OrbitIO and viewable on YouTube.  If you are interested in learning more, watch the video above, and contact your local Cadence sales representative.

Team Allegro


CDNS - RequestDemo

Have a question? Need more information?

Contact Us

© 2025 Cadence Design Systems, Inc. All Rights Reserved.

  • Terms of Use
  • Privacy
  • Cookie Policy
  • US Trademarks
  • Do Not Sell or Share My Personal Information