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Recently, CDNLive China was held in Shanghai. What are the highlights of PCB Track? What are the latest news in the industry? What are the development strategies for Cadence PCB/Packaging? We conducted an exclusive interview with Mr. Saugat Sen, Cadence Allegro R&D Vice President
Figure 1 Mr. Saugat presented Outstanding Paper Award to Spreadtrum
Figure 2: CDNLive China
Figure 3 In PCB Track. Saugat delivered a keynote speech named Enabling System-Level Design with Allegro Technologies.
After the conference, we had the privilege of an exclusive interview with Mr. Saugat. Here are your questions answered:
1, What's the development strategy of Allegro for the future hardware design?
Allegro has been evolving to address the larger issues of system design, aligned with Cadence’s strategy of System Design Enablement. We recognize that the customers’ design challenges today are inter-disciplinary. There is a need to blend implementation and analysis, there is a need to identify manufacturing issues early in design, there is also the need to enable collaboration across mechanical and electrical domains. Our strategy is to collaborate with leading customers across the world, to innovate and leverage all our technology assets to enable solving design challenges that span Chip, Package, Board and the system of multiple boards.
2. How to shorten time to market?
One of the key vectors that we are driving Allegro on is to significantly improve customer productivity. Our concurrent team design solution - Allegro PCB Symphony Team Design solution is just one example of enabling this. We are making ECAD/MCAD co-design seamless, and blending analysis and design closely. It is our endeavor to evolve Allegro to make transformational improvements in our customers’ ability to shorten the PCB design cycle time.
3, How to ensure the success of manufacturing in the future?
We have multiple solutions to address the needs of design for manufacturing success, including new Cadence Allegro DesignTrue DFM Technology, the industry’s first solution to perform real-time, in-design design-for-manufacturing (DFM) checks integrated with electrical, physical and spacing design rule checks (DRCs). Our experience with customers leads us to believe that we need to identify the issues as early as possible in the design process so as to reduce the end to end PCB cycle time.
4, What do you think of China PCB/Packaging market?
China is clearly establishing its thought leadership in technology across multiple domains. While companies in China has been doing leading edge work in PCB for many years, we expect a similar trend in IC Packaging as well. We are fortunate to be in a position to collaborate with our customers in China. We look forward to partner with them in evolving our technology to serve their needs and our customers worldwide.