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Today’s high-performance electronic systems are being driven by ever-increasing complexity and density, requiring designers to consider EMI and EMC, as well as PI/SI and high-speed RF/microwave issues. To accelerate the design process and meet aggressive delivery schedules, engineers need to be able to perform EM cross-fabric and multiphysics analysis to model, simulate, and analyze these effects on chip, package, and system-level designs. EM analysis is critical in both the design and signoff phases for uncovering any unintended EM interactions in the circuit/system, ensuring the design will meet performance specifications, and optimizing the current design by looking at the results of the simulation and then tweaking it to further improve it.
Learn more about electronic system design EM challenges in a newly-released report from CIMData, a leading global product lifecycle management research firm. The commentary delves into the features and benefits of the Cadence Clarity 3D Solver EM simulation software tool and explains how the solution enables designers of PCBs, IC packages, and electronic systems to overcome the most complex EM challenges in systems for 5G, automotive, HPC, and ML applications.