Clarity Solver’s Automated Channel Extraction (ACE) to Be Featured at DesignCon

Visit us at DesignCon 2026, February 24-26, at booth 827, to discover Clarity 3D Solver's automated channel extraction (ACE) technology, a transformative tool designed to eliminate manual bottlenecks to simulating massive multi-channel systems. You will see how the ACE feature provides a scalable, automated path to high-fidelity 3D electromagnetic (EM) analysis, ensuring your designs meet performance targets faster than ever before.

In addition, meet our experts, customers, and partners to learn more about our electronic system design solutions in booth demos, sponsored sessions, and our Cadence networking event.

Demos in Booth 827

• Scalable 3D electromagnetic (EM) modeling solutions for interposer/package/PCB
• Interposer/package/PCB signal, power, and thermal integrity analysis
• How to use real-world measurement data as a foundation for validating EM simulations
• End-to-end design flows for advanced multi-chiplet 3D package design
• DDR5 @ 12.8Gbps MRDIMM Gen2 for AI in the data center
• 224G long-reach SerDes for AI data center systems

Sponsored Sessions

• Tackling the Complexity of Next-Gen IC Packaging: System-Level Design and Analysis Insights, Mark Gerber, Product Management Group Director, IC Packaging, Cadence
• AI-Focused Success Vectors for Achieving Strong Simulation-to-Measurement Correlation, Alfred Neves, CTO, Wild River Technology
• A Case Study on JESD204C Signal Integrity Compliance, Garrett Warren, Electrical Engineer III, Mercury Systems

Cadence Networking Event

Continue your conversations over food and drinks with peers and 12+ Cadence experts at our networking event.

Date: Thursday, February 26

Time: 4:00 pm - 6:00 pm

Location: Great America Ballroom K

See the complete schedule and register now.