Efficient Automotive Electronic Component Design and Analysis

In the automotive industry, there is zero tolerance for field failures, as human safety is at stake. Given the rapid evolution of the electric vehicle (EV) and autonomous driving technologies, it is critical to accelerate the development of robust designs to remain competitive.

Simulation of the PCB and IC package components within complex electronic automotive systems plays a pivotal role in ensuring that designs meet market demands efficiently and effectively. While various simulation solutions are available, the demand for expert simulation resources often outpaces supply, leaving many design teams seeking integrated design and analysis environments where AI can help streamline and guide the process, ensuring designs optimized for performance and safety are delivered on time and on budget.

A webinar is now available on demand that introduces a comprehensive, system-oriented approach to designing and simulating electronic components for automotive applications using Cadence’s Clarity 3D Solver for electromagnetics (EM), Sigrity X Platform for signal and power integrity (SI/PI), Celsius Studio Platform for thermal analysis, and Optimality Intelligent System Explorer for AI optimization.

The webinar explores system-level design challenges unique to EV and autonomous driving design teams and how simulation of the PCBs and IC package components within complex electronic automotive systems is critical in ensuring that designs meet market demands efficiently and effectively. Examples of Cadence workflows for PCB power modules, IC package power modules, and managing signal quality and electromagnetic interference/compatibility (EMI/EMC) from high-speed signals are presented.

EV System-Level SI/PI/EM/Thermal Simulation Issues

Metal-oxide semiconductor field-effect transistors (MOSFETs) are common in automotive components due to their reliability, efficiency, relatively small size, and ability to switch rapidly. Example applications of MOSFETs in automotive electronics include motor control units (e.g., fan motors) that regulate motor speed and torque, EV powertrains that control the flow of power from the battery to the motor, advanced driver-assist systems (ADAS) that power technologies supporting lane departure monitoring and adaptive cruise control, and body electronics that manage power for windows, locks, and lighting systems.

The design challenge is that power creates heat, and heat creates reliability risks and fast switching that can cause interference. Design teams must manage thermal concerns, emissions, and cost/weight for MOSFET design on PCBs, integration in IC packages, and system-level thermal, including electronics cooling. Proper use of MOSFETs results in improved fuel efficiency, performance, and safety.

High-Speed Signal Challenges

In automotive component design, high-speed signaling presents several challenges, including signal integrity, crosstalk, thermal, EMI (emissions and susceptibility), signal routing constraints for complex requirements on PCBs, and specialized shielding techniques. These issues are exacerbated by the harsh automotive environment cars operate in, a wide variety of temperature requirements, vibration, and multi board/connector/cable components.

Designers are required to manage impedance, emissions, and shielding. With proper constraints, signals can be routed and shielded to protect against EMI, with proper design and high-speed signals can travel long distances and maintain signal quality, while proper ground stitching helps to control noise and prevent ground loops.

Conclusion

Power modules and signal integrity within today’s sophisticated automotive products challenge automotive component design teams. Integrating MOSFETs at the PCB level and IC package level requires careful consideration for thermal and EMI com. In addition, Mobile Industry Processor Interface display (MIPI-D) camera interfaces need detailed interconnect modeling, including connectors and cables, to meet industry compliance standards. Cadence offers the following products for automotive power module optimization and automotive high-speed signal integrity signoff.

View this webinar to delve into the details of Cadence’s system-oriented approach to designing and simulating automotive electronic components with an integrated flow for EM, SI/PI, thermal analysis, and AI optimization. A power module substrate example is presented using an IC package MOSFET integration flow, as well as a multi-board signal integrity flow with two interconnected PCBs with MIPI-D pair extraction.