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Enflame Unveils Lab-Correlated Design and Analysis Methodology for 2.5D HBM Designs

• Less than one minute read

At CadenceLIVE China 2022, AI-startup, Enflame Technology, revealed how their engineering teams have overcome silicon interposer design challenges connecting over 1700 signals between an HBM memory stack and their own priority AI-based chip design across a silicon substrate.

The discussion included HBM interface standards that range in data transfer speeds from 2.0 GHz to 7.2 GHz.

A team of Enflame Engineers supported by Cadence Application Engineers presented the Advanced-IC Package design and analysis methodology.  Among the challenges overcome was the accurate simulation of simultaneous switching noise (SSN).  Enflame shared their approach of capturing current with current controlled current source (CCCS) using both a pseudorandom binary sequence (PRBS) and a 1010 data pattern.  Cadence simulation tools used in the analysis flow include Sigrity XcitePI, Clarity 3D Solver, and Sigrity SystemSI.

To learn more, download their presentation here.