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SiP
16.2
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IC Packaging & SiP design
webinar
HDI

Everything You Want to Know About APD / SiP 16.2 - Bill Acito Webinar on March 18

11 Mar 2009 • Less than one minute read

(Note: Click here to view Bill Acito's webinar.)

 

If you caught Jerry GenPart's blog in November on Advanced Plating Bar Checks and wondered what else is new in APD 16.2, you are in luck.  On Wed, March 18, Bill Acito, Product Engineer, will review the long list of new technology available in the latest release.

As an example, you'll see how the latest HDI technology in the Allegro platform is supported in APD / SiP.

 

 New HDI Via visualization 2D and 3D

 

And also the wirebond enhancements.

 

Multiple tiers of wirebond connections in 3D

 

Please join us for the webinar.  To register to see it live or view an archived recording (after March 18), please click here and choose the What's New in IC Packaging / SiP webinar.

 

We look forward to your feedback on this foray through the latest and greatest APD features.

 


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