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Cadence has been a leader in silicon-package and package-board co-design for over a decade now. Today, Cadence introduced a new and innovative solution for FPGA-PCB Co-design.
The FPGA-PCB co-design solution includes proven technology from Taray Inc for optimized, correct-by-construction FPGA I/O pin assignment synthesis that takes into account the placement and routing of the FPGAs.
What is unique about this technology is:
To learn more about this exciting new approach, read more: