• Skip to main content
  • Skip to search
  • Skip to footer
Cadence Home
  • This search text may be transcribed, used, stored, or accessed by our third-party service providers per our Cookie Policy and Privacy Policy.

  1. Blogs
  2. System, PCB, & Package Design
  3. Breaking down the 'virtual' wall
SiPper
SiPper

Community Member

Blog Activity
Options
  • Subscribe by email
  • More
  • Cancel
CDNS - RequestDemo

Try Cadence Software for your next design!

Free Trials
IP
cadence
Allegro 16.2
IC Packaging & SiP design
wirebond profile library
Kulicke & Soffa

Breaking down the 'virtual' wall

20 Aug 2008 • 1 minute read

In the last 3-4 months I have seen, and been involved in, a flurry of discussions around driving design using manufacturing assembly data. Call it "IP" if you want -- its fashionable!! At least two world-leading assembly and test companies -- and more than a handful of leading IC companies -- have started programs to try and bring the manufacturing engineers closer to the design engineers.

The good news, for once, is that the EDA tool supplier (Cadence) and the leader in wirebond assembly equipment (Kulicke & Soffa) were already discussing how we could help designers become more manufacturing aware.  The result is that in the latest release of Allegro (16.2) users now have access to a Kulicke & Soffa validated wirebond profile library that correlates to the same profiles supplied as defaults with their equipment.  If you want to read more about this go here.

What I really want to hear, is what do you other designers or manufacturing engineers think?  Is this a good start, what should be next? Let me know below.

For example should the manufacturing engineer be able to see the design engineers package layout in 3D in order to better understand design intent and allow for a more productive collaboration? What else?


CDNS - RequestDemo

Have a question? Need more information?

Contact Us

© 2025 Cadence Design Systems, Inc. All Rights Reserved.

  • Terms of Use
  • Privacy
  • Cookie Policy
  • US Trademarks
  • Do Not Sell or Share My Personal Information