Modern Thermal Analysis Overcomes Complex Electronic Design Issues

by Melika Roshandell

In the September/October issue of DENA (Design of Electronics North America), Cadence Celsius Thermal Solver is showcased.  By combining finite element analysis with computational fluid dynamics, designers can perform complete thermal analysis/electronic cooling system analysis within a single tool as well as streamlined within a Cadence workflow whether for PCB, IC or packaging.

Read more about the Celsius Thermal Solver.