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Community Blogs System, PCB, & Package Design  Modern Thermal Analysis Overcomes Complex Electronic Design…

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Sherry Hess
Sherry Hess

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featured
in-design analysis
Thermal Analysis
electronic cooling

Modern Thermal Analysis Overcomes Complex Electronic Design Issues

13 Sep 2022 • Less than one minute read

by Melika Roshandell

 In the September/October issue of DENA (Design of Electronics North America), Cadence Celsius Thermal Solver is showcased.  By combining finite element analysis with computational fluid dynamics, designers can perform complete thermal analysis/electronic cooling system analysis within a single tool as well as streamlined within a Cadence workflow whether for PCB, IC or packaging.

Read more about the Celsius Thermal Solver.


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