Never miss a story from System, PCB, & Package Design . Subscribe for in-depth analysis and articles.
By Melika Roshandell
As developers of electronic products strive to meet market demands for smaller and faster devices, the environment for thermal issues is becoming more and more challenging. These problems are widespread and can be in the chip, the board, the package, and/or the entire system and can impact not only the performance of the chip but also package and PCB performance due to resistive losses.
In addition, as electronic designs are shifting toward the use of 2.5D and 3D-ICs, thermal issues are exacerbated because of the heat generation caused by multiple dies that are densely packed, which results in a rise in temperature. Having a clear understanding of the thermal constraints in the early stages of a design enables engineers to avoid long design cycles and achieve maximum performance in a short timeframe.
Melika Roshandell, product marketing director for Cadence’s Celsius Thermal Solver product, talks with David Malinak in a Microwaves & RF QuickChat video about this topic. She discusses the thermal challenges in today’s complex electronic designs and how the Celsius solver addresses them, as well as how the tool works with other design tools in the Cadence portfolio to provide a complete flow. Melika also shares her vision for the future of electronic design and how thermal challenges be addressed.
You can view this insightful eight-minute video here.