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Sigrity and Systems Analysis
Celsius Thermal Solver
Sigrity XcitePI
Sigrity PowerSI
Sigrity Broadband SPICE
Sigrity XtractIM
Sigrity PowerDC
EM
Clarity 3D Solver
T2B
Clarity 3D Workbench
JAE

Sigrity and Systems Analysis 2022.1 HF2 Release Now Available

23 Aug 2022 • 8 minute read

The Sigrity and Systems Analysis (SIGRITY/SYSANLS) 2022.1 HF2 release is now available for download at Cadence Downloads. For the list of CCRs fixed in this release, see the README.txt file in the installation hierarchy.

SIGRITY/SYSANLS 2022.1 HF2

Here is a list of some of the key updates in the SIGRITY/SYSANLS 2022.1 HF2 release: For more details about these and all the other new and enhanced features introduced in this release, refer to the following document: Sigrity Release Overview and Common Tools What's New.

Early Announcement: PowerSI and Clarity Engines Support Automated Extraction Directly From Allegro Canvas

A new workflow will soon be integrated with Sigrity Aurora in the OrCAD® and Allegro® 17.4-2019 QIR4 release to enable greatly simplified and automated interconnect model extraction (IME). The PowerSI and Clarity engines have been enhanced in the Sigrity and Systems Analysis 2022.1 base release to facilitate this new workflow.

Users that are licensed to run Sigrity Aurora II and Sigrity PowerSI II and/or Clarity 3D Solver will benefit from this integration when the following two releases are installed together:

  • OrCAD® and Allegro® 17.4-2019 QIR4
  • Sigrity and Systems Analysis 2022.1 base release

 

Systems Analysis 2022.1 HF2

Celsius Thermal Solver

  • Material Manager Enhancements: The following options have been added in the Material Manager window in the Celsius Solid Objects Simulation for Layered Structures module for better usability.
    • Replace All from Library: Overwrites the materials in the design with matching materials in the material library.
    • Filter by Name and Filter by Property: Filters the materials in the design/material library by their names or properties. When filtering by the material property, you can also include or exclude certain materials from the search results.
    • Clone: Creates a copy of an existing material

  • Support for Adaptive Time Stepping: You can now use adaptive time stepping as the time step criteria in the Celsius Solid Objects Simulation for Layered Structures and the Celsius Solid Objects Simulation for 3D Structures modules. When using the adaptive time stepping criteria, the tool automatically introduces additional time steps whenever there is a change in the power gradient. This results in finer time steps that capture all power changes and lead to improved convergence and better accuracy.

  • Non-Uniform Time Step Criteria: In the Celsius Solid Objects Simulation for Layered Structures and Celsius Solid Objects Simulation for 3D Structures modules, you can now specify non-uniform time steps as the time marching criteria. In non-uniform time stepping, you can divide the total simulation time into smaller chunks and specify variable time intervals for each chunk. You can set smaller intervals to capture rapid power changes and longer intervals when infrequent power changes are expected.

  • Curve Plots Import from External Sources: You can now import curve plots or simulation data from external sources into the curve view window in the Celsius Solid Objects Simulation for Layered Structures module. The imported curve plots can compare experimental data and draw inferences. The imported curve plot should be in .csv format and should have the same data type as the Celsius curve plot.
  • Simplified Model Enhancements: In the Celsius Solid Objects Simulation for Layered Structures, while generating the simplified model file, you can now copy the exact models for solder balls, solder bumps, and wirebond layers into the simplified model file.
  • New Power Scale Factor Option: While setting the power dissipation in the Celsius Solid Objects Simulation for Layered Structures module, you can now set the power scale factor in the Power Scale Factor field. The power scale factor is the ratio of power specified in the power map file to the actual power. For example, if a power of 10W is specified in the power map file and a scale factor of 0.9 is applied, the actual power applied will be 9W.
  • Post-Processing Enhancements: For better and enhanced visualization of field plots, a new GUI has been added to the Celsius Solid Objects Simulation for 3D Structures and Celsius Fluid Flow Simulation modules. The new GUI enables you to perform operations, such as plotting on a slice, a line, and points on the 3D objects, viewing the warpage displacement and plotting results at different time step progressions. In addition, in the Celsius Fluid Flow Simulation module, you can view the velocity flow trajectory using the Streamline option.

For detailed information, refer to Celsius Thermal Solver User Guide on the Cadence Support portal. 

Clarity 3D Solver

  • Support for Encrypted Component Models: Clarity 3D Solver now supports component encryption to enable vendor companies in protecting their IP when sharing their components (such as 3DCapacitors, 3D inductors, 3DConnectors, and off-the-shelf antennas) to hide the inner details of the design, but at the same time enables their customers to use those components and run the 3DEM simulations.

For detailed information, refer to the Japan Aviation Electronics is First to Support IP Protected Models for Cadence Clarity 3D Solver blog. 

 

Sigrity 2022.1 HF2

Broadband SPICE

  • Broadband SPICE Added to Layout Workbench: In this release, Broadband SPICE has been added to Layout Workbench, and the appearance of the user interface has been enhanced. By default, Broadband SPICE now uses a dark application theme.

  • Help Menu Update: The Help menu for Broadband SPICE has been improved and is now consistent with other Layout Workbench tools. 

For detailed information, refer to Broadband SPICE User Guide on the Cadence Support portal.

PowerDC

  • Option to Specify Total Current in Percentage: While specifying an unequal current model in the Sink wizard, you can define the current in percentage (%). This will help you in distributing the current evenly to each node.

  • Support for Extracting PowerTree for Enabled Nets Exclusively: You can now extract PowerTree from the opened design exclusively for the enabled power nets in the Net Manager. The disabled nets from the other branches will not be considered.

  • Detailed Current Summary Export: You can now export the detailed current summary for the BGA pad with each net in a separate sheet for the instances where the package and PCB are merged. This will help you in deciding whether the package and PCB design can be used.

  • Search by Distance: The Search Distance option allows you to group all ground net pins within this search distance (radius) for each signal or power net in the circuit. You can use this option while defining a Sink or VRM.

  • Reuse of SPD File Settings: You can now reuse the PowerDC setup from one .spd file to another. This includes settings like VRMs/SINKs/Discretes/DC-DCs, and so on. This feature will let you copy the settings from the .spd file that you will load into the existing layout file.

For detailed information, refer to PowerDC User Guide on the Cadence Support portal.

T2B

  • T2B added to Layout Workbench: In this release, T2B has been added to Layout Workbench, and the appearance of the user interface has been enhanced. By default, T2B now uses a dark application theme.
  • Help Menu Update: The Help menu for T2B has been improved and is now consistent with other Layout Workbench tools.

For detailed information, refer to T2B Quick Reference Guide on the Cadence Support portal.

XtractIM

  • Option for Setting the Return Path for Individual Nets: In the Electrical Performance Assessment mode, you can select the return path for Power-Ground analysis for individual nets. All the enabled power and ground nets will be available in the Return Net drop-down menu of each net.
  • PLOC Matching Support for Multiple Dies: In Pin-based Model Extraction, you can assign the Die Instance name for each component in a multi-die circuit. It helps you identify the components that belong to a chip. The Die Instance is set to the RefDes name by default. The output SPICE Model shows the node mapping between the .ckt node and the PLOC node of each RefDes component.

For detailed information, refer to XtractIM User Guide on the Cadence Support portal.

XcitePI

  • Defining the MCP Connection Type: You can define the MCP connection type for each layer as DIE or PKG. To define the MCP connection type, click on the MCP Connection Type column entry corresponding to a layer in the SPICE NETLIST form.

For detailed information, refer to XcitePI User Guide on the Cadence Support portal.

 

Sigrity Release Team

 

Please send questions and feedback to sigrity_rmt@cadence.com.

   


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