Sigrity and Systems Analysis 2023.1 Release Now Available

The Sigrity and Systems Analysis (SIGRITY/SYSANLS) 2023.1 release is now available for download at Cadence Downloads. For the list of CCRs fixed in this release, see the README.txt file in the installation hierarchy.

SIGRITY/SYSANLS 2023.1

Here is a list of some of the key updates in the SIGRITY/SYSANLS 2023.1 release: For more details about these and all the other new and enhanced features introduced in this release, refer to the following document: Sigrity Release Overview and Common Tools What's New.

Systems Analysis 2023.1

Celsius Thermal Solver

• Adaptive Thermal Management Using Python API Module: The PCB/PKG Transient Thermal Simulation workflow in the Celsius Solid Objects Simulation for Layered Structures (Celsius 2D) module has introduced a Python Power API module, which allows you to employ adaptive thermal management strategies based on temperature triggers. This feature incorporates thermal mitigation to prevent overheating of devices during heavy workloads.
  
• Parameter Sweeping Updates: A new Optimality form has been added in the Celsius Solid Objects Simulation for 3D Structures (Celsius 3D) and Celsius Fluid Flow Simulation (Celsius CFD) modules to support parameter sweeping. 
• Distributed Computing Setup Updates: The Distributed Computing settings can now be accessed through the Distributed Computing dialog box in the Celsius Solid Objects Simulation for Layered Structures (Celsius 2D) module. Additionally, the Distributed Computing settings for the Server farm now includes a new option called Acquire computer resources at startup that allows the engine to acquire the necessary computer resources in the background before the solver begins.
• Voltus Power Map Import Updates: In the Celsius Solid Objects Simulation for Layered Structures (Celsius 2D) module, when you import a Voltus power map file, in addition to the power density, you can now preview metal density information and add probes to identify areas with high metal density. In addition, if the Voltus power map that you import is a hierarchical power map, you can now view the power information of the Top IP, as well as all the sub-IPs. 
• Material Manager Updates: The Material Manager window in the Celsius Solid Objects Simulation for 3D Structures (Celsius 3D) and Celsius Fluid Flow Simulation (Celsius CFD) modules now includes the Import and Export buttons for transferring material properties to a .csv file. Additionally, instead of exporting the material properties to a .csv file, you can directly copy the values to a spreadsheet application. 
• Ability to Import Heat Transfer Coefficient Information from a CFD File: The Celsius Solid Objects Simulation for 3D Structures (Celsius 3D) module now offers the ability to import the heat transfer coefficients for terminals defined in the Celsius Fluid Flow Simulation (Celsius CFD) and Celsius Solid Objects Simulation for Layered Structures (Celsius 2D) modules.

For detailed information, refer to the Celsius Thermal Solver User Guide. 

Clarity 3D Solver

• Wave Port Support: Support for terminal-based wave ports has been added in Clarity 3D Layout. In Clarity 3D Workbench, the terminal-based wave port feature has been completely enhanced, and support for modal-based wave ports has been added.
• DC-Only Simulation Support: Both Clarity^TM 3D Layout and Clarity^TM 3D Workbench can now run DC-only simulations. While Clarity 3D Workbench uses the default DC solver from Clarity to perform DC-only simulation, Clarity 3D Layout uses either the default DC solver from Clarity or the PowerDC DC solver to perform DC-only simulation.
• Non-Cylindrical Solder Bump/Balls Support: Clarity 3D Layout has been enhanced to model frustum-shaped solder bump/balls. A new Advanced option has been added on the Solder Ball/Bump direction page of the Port Setup Wizard that enables you to specify the parameters for the frustum-shaped solder bump/balls.
• Circuit (Edge) Ports Support: Clarity 3D Layout has been enhanced to support circuit (edge) ports. Circuit ports are similar to lumped ports and can be used when lumped ports and coaxial ports are obstructed by metal or other nets.

For detailed information, refer to Clarity 3D Layout User Guide and Clarity 3D Workbench User Guide on the Cadence Support portal.

Sigrity 2023.1

Broadband SPICE

Direct Launch of Broadband SPICE from the Layout Workbench Toolbar: You can directly launch Broadband SPICE from any of the tools that are part of the Layout Workbench by clicking the Launch Broadband SPICE button in the Layout Workbench toolbar.

For detailed information, refer to Broadband SPICE User Guide on the Cadence Support portal.

Celsius PowerDC

• Support for MCP Header and PLOC File in PowerDC: PowerDC now supports the usage of MCP Header and PLOC file. This will help you in extracting the pin information in the design.
• PowerTree Setup in PowerDC Multi-Board Workflows: The PowerTree Setup is now accessible from the Multi-Board/Package IR Drop Analysis and Multi-Board/Package E/T Co-Simulation workflows in PowerDC.
• Simulation Report Enhancements: A significant number of enhancements have been made to the PowerDC simulation reports. Some major enhancements are listed below:
  • The Multi-Board simulation reports now have the same format as that of the Single-Board simulation reports.
  • The IR-Drop simulation report for the Single-Board and Multi-Board workflows now includes the ambient temperature and conductivity information.
  • The Multi-Board simulation report now includes the complete topology for the DC analysis block diagram results.
  • The Roughness Upper and Roughness Lower columns have been removed from the Board Stackup table in the simulation report for Single-Board and Multi-Board workflows because the roughness cannot be specified anymore in the PowerDC stackup.
• Tcl Commands to Support Multi-Board Workflow Automation: Several new Tcl commands have been added to support multi-board workflow automation.

For detailed information, refer to PowerDC User Guide on the Cadence Support portal.

SPEEDEM

• High-Performance Computing Options for Improved Simulation: Use the High-Performance Computing (HPC) options in SPEEDEM to improve the simulation speed
• EM-Aware SI Simulation Workflow Added: A new workflow mode, EM-Aware SI Simulation, is added for general-purpose signal integrity simulations while considering the non-ideal power/ground effects. 

For detailed information, refer to the SPEEDEM User Guide on the Cadence Support portal.

XcitePI

• XcitePI Ported to Dark Theme: In this release, XcitePI has been ported to dark theme, and the appearance of the user interface has been enhanced. 

For detailed information, refer to XcitePI User Guide on the Cadence Support portal.

Documentation Enhancement

• New Cloud-Based Help System Introduced: Starting with this release, a new cloud-based help system, Doc Assistant, has been introduced. Doc Assistant enables you to access the latest documents available online for all the Cadence products installed on your machine. It has a web application interface through which you can search and view both offline (locally installed) and online (on Cloud) documentation.

  To launch Doc Assistant:

  On Windows
  1. Navigate to the <install_directory>/tools/bin folder.
  2. Double-click cda.exe.

  On Linux
  1. Navigate to the <install_directory>/toolx.lnx86/bin directory.
  2. Type ./cda at the command prompt.

Sigrity Release Team

Please send your questions and feedback to sigrity_rmt@cadence.com.