Streamlining SI/PI Analysis with Clarity 3D Solver’s New ACE Technology

Today’s complex electronic designs, particularly in the context of high-speed interconnects, 3D-ICs, and advanced packaging, require robust electromagnetic (EM) simulation tools that balance accuracy, speed, and integration. Now available on demand, the Cadence TECHTALK, Transform Your S/PI Analysis with Clarity 3D Solver, introduces the new automated channel extraction (ACE) feature within the Clarity 3D Solver and highlights how the core technical advancements in this innovation address the challenges of large-scale simulation, workflow automation, and seamless integration with leading EDA platforms.

ACE Automated Workflow

Clarity ACE technology addresses a critical industry need: the automation of partitioning and channel extraction in large EM designs. Clarity ACE technology represents a significant advancement in EM simulation automation; by automating the partitioning and extraction of complex design channels, the ACE tool streamlines what were previously manual, error-prone processes. With ACE technology, engineers can assign multiple net groups, perform simultaneous cutouts, and serialize or parallelize the entire workflow. This enables rapid reuse and adaptation of simulation setups across multiple design iterations and layouts, greatly reducing setup and post-processing times.

Traditionally, engineers manually select the nets, define partitions, and manage cutouts as individual projects. They then post-process for frequency domain comparisons or masking—a process prone to errors and inefficiency. ACE technology allows users to import layouts, assign net groups, perform cutouts, and serialize or parallelize simulations with minimal manual input.  The flow has been compressed significantly, enabling designers to assign multiple net groups and do multiple cutouts all at the same time and serialize or parallelize the entire process. The figure below shows how Clarity ACE provides a single step process rather than manually manipulating different net groups.

In addition, all the data can be reused from design to design. A very quick partitioning of the entire design can be performed and all the different partitions can be visualized before the simulation is run. The solve progress and the results can be viewed through a single interface using Clarity 3D Solver’s benefits and gold-standard accuracy.

Manual sub-modeling is no longer needed, as the software intelligently segments and solves many channels of a larger system. The tool provides re-aggregation by automatically stitching results back together, providing a holistic view of system performance without the manual overhead. Pre- and post-processing is streamlined by automating the signal integrity/power integrity (SI/PI) data workflow around a high-performance solver, significantly reducing time to results.

Instead of just solving the different blocks serially, engineers can select how many different compute resources are available and how many solves and licenses of Clarity 3D Solver can be used at the same time. Simulation progress can be monitored and load and plot results obtained. As can be seen in the figure below, some of the simulations have already been completed as other ones are starting. This enables the designer to solve several or all of the problems simultaneously, depending on the available resources. Also, from this window, results can be loaded and plotted by going to the view results button.

Integration with Design and Analysis Platforms

A key differentiator of Clarity ACE technology is its deep integration with the broader Cadence ecosystem. The Clarity solver is accessible directly within the Virtuoso Layout Suite for IC-centric and module-centric workflows. Multiple fabrics, such as package modules and ICs, can be imported and simulated natively. In addition, through the Allegro X Design Platform engineers can run Clarity-based analysis workflows from the Allegro PCB and package design environment.

Conclusion

Clarity ACE technology is being employed across a range of high-impact applications, including high-speed packaging, module design, interposers, and advanced IC-level simulations. Its automation and integration capabilities have enabled customers to compress design cycles, reduce manual setup, and achieve rapid, repeatable results. The tool is actively used in customer projects.

Clarity 3D Solver and ACE technology represent a new paradigm in 3D EM simulation, combining automation, scalability, and integration to meet the demands of modern electronic design. By reducing manual effort, enabling parallelized workflows, and supporting comprehensive post-processing, these tools empower engineering teams to achieve faster, more accurate results and accelerate innovation.

To learn more about Clarity 3D Solver and ACE technology, view the webinar on demand here.