Integrity 3D-IC Course Updated for Version 25.1

15 Dec 2025 • 1 minute read

Unlocking Advanced 3D-IC Design: The Updated Integrity 3D-IC Course

The semiconductor industry is rapidly evolving, and so are the tools and methodologies that enable cutting-edge designs. To keep pace with these advancements, the Integrity 3D-IC course has been updated to deliver a comprehensive learning experience for engineers working on next-generation packaging and integration challenges.

What's in the Updated Course?

The latest version of the course introduces enhancements aligned with Integrity 3D-IC Platform 25.1, offering a unified environment for 3D planning, implementation, and system analysis. This update ensures learners gain hands-on experience with the most advanced features for multi-die integration and interposer design.

Key features include:

Expanded System Planner Capabilities: Learn to create interposer devices and integrate ASIC and HBM components seamlessly.
Advanced Routing Techniques: Explore NanoRoute for high-performance interposer routing and shielding strategies for HBM bus nets.
Tcl-Based Automation: New modules highlight scripting workflows for batch-mode design creation and implementation.
Power Integrity and Signal Integrity Focus: Updated labs emphasize PDN creation and connectivity verification for robust designs.

Course Structure

The course spans two days, combining interactive modules and practical labs:

Module Highlights:
- Top-level integration and placement of ASICs, HBMs, and interposers.
- Netlist creation, bump, and TSV generation.
- Routing and shielding techniques for high-speed interfaces.
Lab Enhancements:
- Creating C4 bumps and placeholder cover bumps.
- Adding TSVs for C4 connections.
- Routing feedthrough nets and verifying DRC compliance.
- Batch-mode implementation for streamlined workflows.

Who Should Attend?

This course is designed for IC designers and engineers focused on 2.5D/3D-IC packaging, interposer design, and system-level integration. A basic understanding of routing principles, signal integrity, and IC fundamentals is recommended.

Why It Matters

As 3D-IC technology becomes central to high-performance computing and AI workloads, mastering these tools is critical. The updated Integrity 3D-IC course equips you with the skills to tackle complex multi-die designs efficiently and confidently.