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The System Analysis Knowledge Bytes blog series explores the capabilities and potential of the System Analysis tools offered by Cadence®. In addition to providing insight into the useful features and enhancements in this area, this series aims to broadcast the views of different bloggers and experts who share their knowledge and experience on all things related to System Analysis.
It was the summer of '07, a balmy 95-degree day where staying inside and playing on my gaming console was the best way to enjoy the day. Everything was great, I loaded my saved file, donned my helmet as the Master Chief, and was ready to take on the Covenant. A few hours in, and every gamer's worst nightmare happened; my system crashed. Two blinking red lights had signaled that my console had overheated. Perhaps if more thermal analysis had been completed, I wouldn't have lost 3 hours of game time; perhaps Celsius Thermal Solver could have saved that day.
Thermal analysis is an ever-growing concern as power density and design complexity continue to increase, and product sizes continue to decrease. Celsius Thermal Solver is an analysis tool for predicting the effects of temperature distribution on the design of integrated circuits, packages, PCBs, and systems. Early detection and resolution of thermal compliance issues in the design cycle are critical for successful product development and prevents the potential delays and costly design fixes that otherwise might occur. Cadence will be hosting a free Celsius Thermal Solver training webinar for electrical and thermal co-simulation, where we will cover an Electronics Cooling (EC), formerly known as Computational Fluid Dynamic (CFD), workflow for PCB thermal analysis.
Celsius Thermal Solver is the industry's first complete electrical-thermal co-simulation solution for the full hierarchy of electronic systems from ICs to physical enclosures. A common problem that is encountered in thermal and electrical testing and design is due to the relationship between heat and electrical resistance. Typically, as components warm up, their electrical resistances increase. And when electrical resistances of those components increase, so does their temperature as more electrical energy is converted to heat. Clearly, this is a self-feeding problem, and the solution requires convergence between the temperatures of the system and the electrical nuances of the system, and this convergence must be within both thermal and electrical tolerances for the system. For a static simulation, this can be fairly simple. But once we add in fans, heatsinks, enclosures, and other various components, the solution becomes a bit more complex.
An Electronics Cooling (EC) simulation will create a thermal model of the effects of airflow and a chassis by utilizing a computational fluid dynamics engine. In fact, this EC simulation is required when a system is accounting for the cooling effects of a fan and a chassis. The EC simulation will create a Heat Transfer Coefficient mapping file that defines the heat transfer coefficients for all the devices in the design, and this mapping file can be imported into Celsius Layered Structures so an accurate electrical and thermal co-simulation can be run that will include the cooling effects of the chassis, fans, and airflow.
The free training webinar for Celsius will cover the following topics:
Thursday, June 15, 2023
07:00 PDT San Jose / 10:00 EDT New York / 15:00 BST London / 16:00 CEST Berlin /
17:00 IDT Jerusalem / 19:30 IST Bangalore / 22:00 CST Beijing
To register for the Celsius Thermal Solver: Electrical and Thermal Co-Simulation webinar, use the link found HERE and sign in with your Cadence Support account (email ID and password) to log in to the Learning and Support System. Then select "Enroll" to register for the session. Once registered, you'll receive a confirmation email containing all login details.
If you don't have a Cadence Support account, go to Registration Help, or Register Now and complete the requested information.
I hope to see you all there!
Datasheet link here
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