This Month in IDA

This month the In-Design Analysis (IDA) team kicked off its new blog program with an insightful look at “High-Tech Everything” from group director Sherry Hess and advice from our Celsius expert Melika Roshandell on finding and fixing thermal PCB problems sooner rather than later.

In addition to these viewpoints, new articles, collateral, and web events transpired.  If you missed any or all, here's your chance to catch up on all things IDA of recent.

IDA in the News

• Microwaves & RF: Thermal Analysis is Vital for High-Power MMIC, MCM, and RF PCB Apps
• Electronic Design: Conquer Signal, Power, and Thermal Challenges Implementing GDDR6 Interfaces

New Collateral

• EMX White Paper: Silicon Chip EM Simulation for RFICs
• Celsius White Paper: Optimize Designs in Automotive Applications

Web Events:

• On Demand: What’s New in Clarity 2022
• On Demand: Overcoming System-Level 3D-IC Electrical and Thermal Challenges
• On Demand: In-Design EM Analysis for Microwave/RF Design Workflows