This Month in IDA

This month’s IDA activities include a host of white papers spanning EM analysis to SI/PI to thermal optimization. In addition to technical content, our group director Sherry Hess chatted with Microwave Journal’s Pat Hindle about the fascinating applications you might not know Cadence software drives. In addition, product marketing director Dr. Melika Roshandell and product marketing manager David Vye both posted new blogs. One is a traditional written piece titled "Successful Thermal Management of 3D-ICs: Accurate, Fast, Efficient and Scalable with Celsius," and the other is a video blog interview with David Maliniak of Microwaves & RF magazine.

IDA in the News

• Microwave Journal Podcast: Exciting Applications Enabled by Cadence System Analysis Solutions
• Microwaves & RF QuickChat: Trends in RF/Microwave System Design
• LinkedIn Article: 

New Collateral

• EM Analysis White Paper: Advances in EM Analysis and Design Flows for RF System Development
• Sigrity White Paper: Sigrity X Power-Aware SI Analysis for DDR5
• Celsius White Paper: Thermally Optimizing a High-Power PCB
• Celsius White Paper: Thermal Warpage Simulation of a Temperature-Dependent Linear Elastic Material Package

 Web Events

• On Demand: Conquer SI/PI Challenges and Reduce Time to Signoff for PCIe 6.0