This Month in IDA

The IDA group was busy during August producing collateral and two Quickchat videos with Microwaves & RF. Melika Roshandell discussed with David Maliniak the thermal issues associated with today’s smaller, faster electronic devices and how the Cadence Celsius Thermal Solver helps engineers clearly understand and mitigate thermal constraints in early stages of design to achieve maximum performance in a short timeframe. And Sherry Hess discussed Optimality and Oncloud with David Maliniak as well.

Cadence’s new Clarity encryption technology is overviewed in a new IDA post that highlight how JAE has embraced it to release a line of connectors into the market. In general, Clarity encryption enables designers to protect the underlying IP of their 3D components by hiding the main portions of the design while sharing only the geometries needed with customers and partners.

We also have a new  white paper and application note detailing the integrated AWR Design Environment/Celsius Thermal Solver  workflow.

IDA in the News

• QuickChat: Overcoming Thermal Challenges in Modern Electronic Design

New Collateral/Blogs

• White Paper: AWR Celsius Workflow

• Application Note: MMIC PA on PCB

• Blog: Clarity Encrypted Connectors