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Most package designs have wire bonding and reusing the wire bond information for other similar dies placed in the design significantly improves the efficiency and reduces the turnaround time. Allegro® Package Designer Plus provides Place replicate commands to replicate and reuse modules in the same or other designs. In the latest 17.4-2019 HotFix 019 of Allegro Package Designer Plus, Place replicate commands are enabled for the packaging design. These modules with wire bond information can be replicated to similar dies in a design. In this blog, we will discuss how to reuse wire bonds in designs using the Place replicate commands.
The first step to replicate a wire bond is to create a seed circuit or module that includes a die with wire bond information. The seed circuit saved as a module (.mdd) file can then be applied to similar dies in any design. The Place replicate create command is used to create modules and is available only in the Placement Edit application mode.
Use the following steps to create a module:
The selected die and wire bonds are now part of the module. This module act as a seed circuit to replicate the wire bond for other similar dies placed in a design. The module created, using the Place replicate create command, when saved is locked by default to prevent accidental editing.
The Place replicate apply command is used to apply wire bonding to other similar dies present in a design. This command uses previously-created modules and replicates them in a design. To use this command:
Using the Place replicate apply command, wire bonds are replicated for all the selected dies. This process saves a lot of time and avoids errors that may arise from importing the wire bonds.
Editing and updating a module design is a simple procedure. First, unlock the SEED circuit by right-clicking on the module and choosing the Unlock command from the pop-up menu.
Edit the wire bond of the SEED circuit. The following image shows that the wire bond of the SEED circuit is shoved to different locations.
Running the Place replicate update command on the SEED circuit, updates other replicated circuits with a single click.
The Place replicate set of commands in Allegro Package Designer Plus provides an effortless way to replicate the wire bonds on other dies. This is the most convenient and fastest method to replicate wire bonds for similar designs!
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