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“Time to design completion” is almost always the primary metric and the cause for the most angst within a design team. Your customers demand that a package design is completed as quickly as possible to minimize the impact to their overall schedule.
Sometimes completing the task is not about difficulty, but about the volume of the work -- the number of interfaces, the number of routes, the placement of a large number of components. A single designer can be a bottleneck for no other reason than their design throughput. Sure, automation can significantly improve the capacity of a single designer, but sometimes the situation really needs multiple designers to collaborate, divide and share the load. Yes, you can build a barn with a single carpenter; you can obviously build it much faster with a team of carpenters. The Allegro PCB Symphony Team Design Option enables you to bring a team of designers and engineers to bear on a design to finish it faster, and it’s just not for PCB.
Enabled as an option on the SIP Layout XL tier (either on the .mcm or .sip database) and available now, IC packaging design team members can share the load simultaneously between different designers and design disciplines on a common canvas; each contributor can see the updates being made real time. A large processor, RF, ASIC, or interposer design can have multiple designers working on different busses, functional areas or layers simultaneously, either under a formal distributed plan of attack using a design server, or on an ad hoc basis e.g. a layout designer consulting with a SI or PI expert as needed, simultaneously, on a specific challenging area of the design, in the same conference room or across the globe with just your own laptops with a minimum of set-up.
Request a demo, and see how the Symphony Team Design Option can boost your team's throughput.