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The ability to distribute circuit and electromagnetic (EM) simulations across multiple processors on a single computer or across external remote compute farms can dramatically reduce the overall simulation time for resource-intensive MMIC, RFIC, and cross-fabric design problems. By leveraging parallel computing, design teams can readily optimize on-chip component values with EM-level accuracy, fully explore design options through hundreds if not thousands of optimization iterations, and verify the performance of large-scale systems (chip, package, and board assemblies). In this webinar, Recon-RF, developers of custom MMICs and RF modules, will discuss how their engineers use the distributed EM analysis option in Cadence RF solutions to accelerate product development and improve high-frequency amplifier performance.
Tuesday, March 24, 2021
11:00am - 12:00pm PDT
Nick Chopra is the CTO of Recon-RF where he leads design teams for the development of Custom-MMICs and Modules for DoD, space, and commercial wireless customers. Nick has led Recon-RF to win numerous prime and subcontracts for products in these industries. Nick has over 20 years of industry RF product design experience. Prior to Recon-RF, he worked at Space-Park at TRW/Northrop Grumman working on similar efforts. He has a BSEE and MSEE in Electromagnetics from UCLA, preceded by an enlistment in the U.S. Marine Corps.
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III-V and MMIC Design
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