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CFD
Celsius Thermal Solver
Whiteboard Wednesdays
3D IC
FEM
Computational Fluid Dynamics
Thermal Analysis
finite element analysis
FEA

Whiteboard Wednesdays - The Need for Electro-Thermal Co-simulation

8 Oct 2019 • Less than one minute read

In this week's Whiteboard Wednesdays video, Tom Hackett explains the need for electrical-thermal co-simulation based on finite element analysis (FEA) to support SoC designs utilizing advanced packaging methods such as 3D IC stacks. For a detailed explanation of the mathematics behind Finite Element Analysis, see this excellent video by Grasp Engineering:  Practical Introduction and Basics of Finite Element Analysis

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