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Corrie Callenbach
Corrie Callenbach
8 Oct 2019
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Whiteboard Wednesdays - The Need for Electro-Thermal Co-simulation

In this week's Whiteboard Wednesdays video, Tom Hackett explains the need for electrical-thermal co-simulation based on finite element analysis (FEA) to support SoC designs utilizing advanced packaging methods such as 3D IC stacks. For a detailed explanation of the mathematics behind Finite Element Analysis, see this excellent video by Grasp Engineering:  Practical Introduction and Basics of Finite Element Analysis

Tags:
  • CFD |
  • Celsius Thermal Solver |
  • Whiteboard Wednesdays |
  • 3D IC |
  • FEM |
  • Computational Fluid Dynamics |
  • Thermal Analysis |
  • finite element analysis |
  • FEA |