Cadence® system design and verification solutions, integrated under our System Development Suite, provide the simulation, acceleration, emulation, and management capabilities.
System Development Suite Related Products A-Z
Cadence® digital design and signoff solutions provide a fast path to design closure and better predictability, helping you meet your power, performance, and area (PPA) targets.
Full-Flow Digital Solution Related Products A-Z
Cadence® custom, analog, and RF design solutions can help you save time by automating many routine tasks, from block-level and mixed-signal simulation to routing and library characterization.
Overview Related Products A-Z
Driving efficiency and accuracy in advanced packaging, system planning, and multi-fabric interoperability, Cadence® package implementation products deliver the automation and accuracy.
Cadence® PCB design solutions enable shorter, more predictable design cycles with greater integration of component design and system-level simulation for a constraint-driven flow.
An open IP platform for you to customize your app-driven SoC design.
Comprehensive solutions and methodologies.
Helping you meet your broader business goals.
A global customer support infrastructure with around-the-clock help.
24/7 Support - Cadence Online Support
Locate the latest software updates, service request, technical documentation, solutions and more in your personalized environment.
Cadence offers various software services for download. This page describes our offerings, including the Allegro FREE Physical Viewer.
Get the most out of your investment in Cadence technologies through a wide range of training offerings.
This course combines our Allegro PCB Editor Basic Techniques, followed by Allegro PCB Editor Intermediate Techniques.
Virtuoso Analog Design Environment Verifier 16.7
Learn learn to perform requirements-driven analog verification using the Virtuoso ADE Verifier tool.
Exchange ideas, news, technical information, and best practices.
The community is open to everyone, and to provide the most value, we require participants to follow our Community Guidelines that facilitate a quality exchange of ideas and information.
It's not all about the technlogy. Here we exchange ideas on the Cadence Academic Network and other subjects of general interest.
Cadence is a leading provider of system design tools, software, IP, and services.
Has anyone experienced on using of IPC-7351 level C footprints? Presently I'm using it in one of our project which is a very dense and space constraint board. My concern is,
Any input will be appreciated.
SMT machines(particularly Fuji) have been able to place anything we come up with for the past 20 years. Solder bridging and being able to rework a single part without affecting other parts have been factors.
You need to get project management involved with assembly engineering.
A dumb test board to find out assembly issues in your factory might pay off if you are working on a high-volume design.
Assembly will want a low-risk/easy board to build. But, marketing is going to push beyond that.
My experience has been similar to what Robert posted above. We place at minimum feature separation (3 to 5 mils) and the boards are fine. Yes, the assembly houses, especially the poor ones, will cry and complain but the good ones build with no issue. Rework as he says can be problematic but that is a trade-off necessary to acheive the part density that we are at.
In reply to redwire:
Thanks all for your kind reply. It will be really helpfull.